A complete application in a minute
Tailored resume and cover letter, ready to send.
Flexon Technologies Talent360.ai seeks a Hardware Design and Failure Analysis Engineer in San Jose, on-site, to guide advanced hardware design and rigorous failure analysis across PCIe Gen4/5/6, DDR4/5, and high-speed SerDes. You will coordinate with suppliers and internal teams to diagnose complex failures and drive reliability improvements.
The ideal candidate holds a B.S./M.S. in Electrical/Computer Engineering with 10+ years in hardware engineering, excelling in power and signal integrity
Job Title: Hardware Design and Failure Analysis Engineer
Location: San Jose, CA (On-Site)
Job Description:
Education & Experience:
B.S. or M.S. in Electrical Engineering, Computer Engineering, Materials Science, or related field with 10+ years of progressive experience in hardware engineering, board design, or system-level failure analysis.
High-Speed Hardware Expertise:
Well versed in modern system architectures (PCIe Gen4/5/6, DDR4/5, HBM, 56G/112G/224G SerDes, optical transceivers).
Power & Signal Integrity:
Proven ability to debug complex power distribution network issues/multi-phase VRM transient droop, PMBus/SVID telemetry, switching noise) and high-speed signal integrity anomalies.
Hands-on experience directing external silicon suppliers and analytical Laboratories through component-level physical FA.
Communication:
Strong executive presence with proven capability to articulate complex technical findings to cross-functional leaders and enterprise customers.
Preferred Qualifications:
Experience leading hardware quality or reliability taskforces for hyperscale cloud service providers (e.g., Microsoft, Meta, Google, AWS).
Knowledge of advanced packaging technologies (chiplets, 2.5D/3D ICs, CoWoS) and silicon failure mechanisms.
Proficiency in writing custom Python or C automation tools to recreate corner-case/intermittent hardware race conditions.