Global Package Integration Engineer, NPI & Testing Leader

AMD

Austin (TX)

Hybrid

USD 120,000 - 190,000

Full time

4 days ago

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Job summary

AMD seeks an experienced Advanced Package Integration Engineer to drive package process development and product NPI for EPYC server products. You will own package planning, development, and qualification across cross-functional teams and external suppliers.

You will lead global teams to design test vehicles, qualify processes, and solve technical and schedule challenges to meet milestones. This role offers exposure to multiple disciplines and strategic impact.

Qualifications

Hands-on experience with advanced 3D packaging, wafer-level assembly, substrate assembly, RDL, bumping, polymers.
Experience leading global project teams and managing NPIs and qualifications.
Proven ability to drive process development, yield improvements and reliability enhancements.

Responsibilities

Define test-vehicle and product-package designs and create execution plans with cross-functional teams.
Lead technology development and product NPI, coordinating milestones across geographies and suppliers.
Identify technical and schedule risks; develop and implement mitigation plans.
Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
Collect, analyze, and present data to drive technical decisions and continuous improvement.
Communicate technical status, recommendations, and risks to program managers and senior leadership.
Collaborate with material/equipment suppliers, OSATs, foundries, and other ecosystem partners to enable product success.