GenAI Signal Integrity Lead for Next-Gen AI Hardware

Socket.dev; Austin (TX); On-site; USD 180,000 - 260,000; Full time

Job summary

AMD is seeking a visionary leader to guide a team of signal integrity engineers in developing a GenAI Product Design Guide, pushing high-speed signaling and system-level performance across copper and optical interconnects.

You will collaborate across SERDES, packaging, power, and board engineering to deliver breakthrough PCB architectures for AI hardware, operating under tight schedules and demanding timelines.

Qualifications

• Modeling various channel components for high speed signaling.
• Proficient with serial link simulation tools including PAM4.
• Experience directing PCB layout of high speed serial links.
• Knowledge of cable and connector construction for high speed data transmission.

Responsibilities

• Lead development of the GenAI Product Design Guide with a focus on signal integrity and system-level performance.
• Collaborate with SERDES and packaging teams to ensure silicon meets GenAI leadership goals.
• Drive model creation and simulation for ultra-high-speed signaling technologies.
• Push the limits of copper interconnects and explore optical signaling for rack-level networking.
• Partner with the Power Design team to deliver the highest power-capable PCB without compromising other domains.
• Work with the PCB technology team to achieve industry-leading layer counts and quality.
• Coordinate with Board Engineering and Layout teams to support the largest silicon package ever conceived.
• Ensure success of unprecedented copper bandwidth Ethernet switching within the rack.

Skills

Modeling high-speed channels

Serial link simulation tools

PCB layout of high-speed links

Copper and optical signaling knowledge

Education

Bachelor’s or Master’s in Electrical/Computer Engineering

Tools

PAM4 simulation tools

Job description

AMD is seeking a visionary leader to guide a team of signal integrity engineers in developing a GenAI Product Design Guide, pushing high-speed signaling and system-level performance across copper and optical interconnects.

You will collaborate across SERDES, packaging, power, and board engineering to deliver breakthrough PCB architectures for AI hardware, operating under tight schedules and demanding timelines.