GaN HEMT & RF Microelectronics Process Engineer

Raytheon; Andover (MA); On-site; USD 87,000 - 165,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) match

Flexible schedules

Paid time off

Holidays

Job summary

RTX's RF Microelectronics Department in Andover, MA seeks a Microelectronics Integration Engineer to support manufacturing of GaN HEMT wafers, overseeing fabrication, process control, and delivery to DoD and external customers.

The candidate will work with cross-functional teams to troubleshoot tooling, improve yields, and drive reliability, using expertise in semiconductor processing and circuit testing.

Qualifications

• Bachelor’s degree in STEM and 5+ years of prior relevant experience, or an advanced degree with 2 years of experience.
• Experience with semiconductor processing tools and techniques including photolithography, wet and dry etching, metal evaporation, metrology tools, and automated inspection systems.
• Ability to obtain and maintain a U.S. government security clearance; U.S. citizenship required.

Responsibilities

• Participate in failure investigation teams addressing scrap, product performance issues, or yield excursions.
• Support teams in improving process technology health (performance, reliability, variation, unit cost, cycle time, capacity/throughput).
• Manage in-line electrical data trends and process control metrics.
• Maintain technical documentation (recipes, out-of-control action plans, FMEAs).
• Collaborate with operations, quality, and engineering staff in dynamic team environments.
• Manage evolving projects and priorities based on production needs.

Skills

Semiconductor processing

Photolithography

Etching

Metrology

Education

Bachelor’s Degree in STEM

Tools

FMEA tools

Metrology equipment

Job description

RTX's RF Microelectronics Department in Andover, MA seeks a Microelectronics Integration Engineer to support manufacturing of GaN HEMT wafers, overseeing fabrication, process control, and delivery to DoD and external customers.

The candidate will work with cross-functional teams to troubleshoot tooling, improve yields, and drive reliability, using expertise in semiconductor processing and circuit testing.