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Lexas Technologies US is a trusted partner of a leading supplier of wafer fabrication equipment and services to the global semiconductor industry. We deliver innovative solutions in Plasma Etch, Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), Electrochemical, and Wafer Wet Cleaning, supporting complex, high-tech multi-service projects worldwide.
Role Description
This is a full-time, on-site role for a Field Service Engineer based in Boise, ID. The Field Service Engineer will install, maintain, and repair equipment, ensuring optimal performance. Daily responsibilities include troubleshooting and resolving technical issues, performing preventive maintenance, and providing technical support for equipment and systems. Additionally, the role requires maintaining strong relationships with customers to deliver exceptional service and effective solutions.
Key Responsibilities
Requirements
Preferred Qualifications
Physical Requirements
Travel & Training
Why Join Lexas Technologies US?
You’ll work with cutting‑edge semiconductor equipment in a supportive, growth‑oriented environment that values expertise, initiative, and continuous learning. We offer competitive pay, comprehensive benefits, and real opportunities for technical and professional advancement.
If you have the technical aptitude, hands‑on repair experience, and desire to build a career in the semiconductor industry, we want to hear from you.
Three weeks of paid time off.
Twelve paid holidays.
Annual company performance bonus.
Annual review and raise.
401k matching up to 4%.
Retention bonus (5 years)
Pay Range
$30-42 per hour (dependent on experience)