Field Application Engineer - Datacom & High-Speed Interconnects

Molex; Frisco (TX); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Company car

Bonus

Medical benefits

Job summary

Molex invites a Field Application Engineer to serve as the technical interface between Molex and ODM and data center customers, driving design-in and design-win activity across high-speed copper, power and fiber interconnect solutions.

You will partner with customer engineering teams to solve complex system challenges, influence next-generation designs, and accelerate adoption of Molex solutions in datacom, cloud, and hyperscale environments. 30-40% travel across North America.

Qualifications

• Bachelor's degree in engineering or related technical field.
• Experience interacting with customers or cross-functional teams.
• Ability to manage multiple priorities in a field-based role.

Responsibilities

• Drive design-in and design-win activity with ODM and data center customers.
• Serve as a trusted technical advisor to customer engineering teams.
• Partner with Sales, Product Management, and SI teams to deliver optimized interconnect solutions.
• Support integration and troubleshooting of connectors, cables, and high-speed interconnect systems.
• Identify and develop new application opportunities aligned to customer roadmaps.
• Translate customer feedback into insights that influence product development.
• Develop technical documentation and application notes to support customer adoption.

Skills

Customer engagement

Cross-functional collaboration

Problem solving

CAD tools familiarity

Education

Bachelor's degree in engineering

Tools

CAD tools

Signal integrity concepts

Job description

Molex invites a Field Application Engineer to serve as the technical interface between Molex and ODM and data center customers, driving design-in and design-win activity across high-speed copper, power and fiber interconnect solutions.

You will partner with customer engineering teams to solve complex system challenges, influence next-generation designs, and accelerate adoption of Molex solutions in datacom, cloud, and hyperscale environments. 30-40% travel across North America.