FIB/SEM Lab Technician — Wafer Analysis (Night Shift)

Headway Technologies; Milpitas (CA); On-site; USD 35,000 - 55,000; Full time

Job summary

Headway Technologies in Milpitas, CA is seeking a FIB/SEM Technician to support wafer characterization using Dual Beam microscopes for TEM sample preparation. The role involves high‑throughput lamella prep, imaging with SEM or Dual Beam, and contributing to failure analysis in a cleanroom‑like lab environment.

Candidates should have an Associate degree in Electronics or Industrial Technology, with two years of hands‑on SEM/FIB/SEM experience, working knowledge of wafer fabrication, and

Qualifications

• Associates degree in Electronics or Industrial Technology and/or equivalent relevant experience; Bachelor’s degree in Engineering, Materials Science, or Physics preferred
• Two years of hands‑on experience using SEM or FIB/SEM microscopes in a semiconductor environment
• Knowledge of microscopy processes and procedures
• Proficient in the use of Microsoft Office Applications

Responsibilities

• Sophisticated and high-throughput TEM lamella sample preparation
• Supports wafer characterization and engineering processes to ensure wafer, rowbar, and slider samples are mounted correctly and efficiently for Dual Beam TEM sample preparation
• Uses SEM or Dual Beam for some imaging and performs failure analysis as needed
• Assists with troubleshooting and resolving basic microscope issues
• Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives
• Responds to inquiries from other team members, managers, or departments
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

Skills

Microscopy

Data analysis

Communication

Critical thinking

Education

Associate degree

Bachelor's degree preferred

Tools

SEM

FIB/SEM

Dual Beam

Job description

Headway Technologies in Milpitas, CA is seeking a FIB/SEM Technician to support wafer characterization using Dual Beam microscopes for TEM sample preparation. The role involves high‑throughput lamella prep, imaging with SEM or Dual Beam, and contributing to failure analysis in a cleanroom‑like lab environment.

Candidates should have an Associate degree in Electronics or Industrial Technology, with two years of hands‑on SEM/FIB/SEM experience, working knowledge of wafer fabrication, and