Faliure Analysis and Reliability Technician

Tata Electronics Private Limited; American Samoa; On-site; USD 45,000 - 75,000; Full time

Job summary

Tata Electronics Private Limited is seeking a Failure Analysis Technician to perform imaging, cross-sectioning, and non-destructive inspection of semiconductor packages. The role involves exposing die surfaces through laser and chemical decapsulation, maintaining lab equipment, and upholding 5S standards to ensure accuracy and efficiency.

Strong documentation and independent work ability are essential. The candidate should have a bachelor’s degree or diploma in Electronics or Materials Science,

Qualifications

• Bachelor’s degree or Diploma in Electronics, Materials Science, or related field.
• Experience in failure analysis within the semiconductor industry is preferred.
• Hands-on with optical microscopes, SEM, C-SAM, laser and chemical decapsulation preferred.
• Able to work independently and in a team in a fast-paced environment.
• Strong communication and documentation skills.

Responsibilities

• Imaging using optical microscopes and SEM for data curation and failure analysis.
• Cross-sectioning of semiconductor devices to analyse internal structures and identify failure mechanisms.
• Operate C-SAM for non-destructive inspection of package integrity.
• Perform laser decapsulation and chemical decapsulation to expose die surfaces for analysis.
• Maintain laboratory equipment and 5S standards in the lab.
• Document and report findings clearly for review and decision-making.

Skills

Failure analysis

Semiconductor

Documentation

Teamwork

Communication

Education

Bachelor’s degree or Diploma in Electronics or Materials Science

Tools

Optical microscopes

SEM

C-SAM

Laser decapsulation

Chemical decapsulation

Job description

Key Responsibilities:

• Imaging using optical microscopes and SEM (Scanning Electron Microscopy) for data curation and failure analysis.
• Perform cross-sectioning of semiconductor devices to analyse internal structures and identify failure mechanisms.
• Operate C-SAM (C-mode Scanning Acoustic Microscopy) for non-destructive inspection of package integrity.
• Perform laser decapsulation and chemical decapsulation to expose die surfaces for failure analysis/data curation.
• Conduct routine maintenance of laboratory equipment to ensure optimal performance and accuracy.
• Maintain 5S standards in the lab to ensure a clean, organized, and efficient working environment.
• Document and report findings clearly and accurately for further review and decision-making.

Qualifications:

• Bachelor’s degree/ Diploma or equivalent in Electronics, Materials Science, or a related field.
• Experience as a Failure Analysis Technician or in a similar role within the semiconductor industry is preferred.
• Hands-on experience with optical microscopes, SEM, C-SAM, laser decapsulation, and chemical decapsulation is preferred.
• Ability to work independently and as part of a team in a fast-paced environment.
• Strong communication and documentation skills.