Failure Analysis Engineer

Absolics Inc.; Covington (GA); On-site; USD 70,000 - 115,000; Full time

Job summary

Absolics Inc. is seeking a Physical Failure Analysis Engineer to perform in-depth failure analysis on glass substrates.

The role involves advanced microscopy, spectroscopy, and metallurgy to identify root causes, with a strong electrical engineering background and the ability to work independently and in a team. The ideal candidate will handle sample preparation, image analysis, data interpretation, and reporting, using SEM, FIB, TEM, FTIR, and EDX to characterize failures and to contribute to

Qualifications

• Bachelor's degree in materials science, electrical engineering, or related field.
• Experience with physical failure analysis in semiconductor or electronic contexts is preferred.
• Proficiency with microscopy and analytical tools (FTIR, EDX) is required.

Responsibilities

• Investigate physical failures and defects using advanced microscopy and analytical techniques.
• Prepare samples for analysis (cutting, polishing, coating) while preserving features.
• Use optical and electron microscopes to examine samples at various scales.
• Analyze images to identify defects, fractures, and anomalies.
• Analyze data from analyses to understand failure mechanisms.
• Generate detailed reports of findings, methodologies, and recommendations.
• Perform mechanical and thermal testing as part of failure analysis.
• Prepare documentation of results and collaborate to improve processes.
• Support OQA with analysis results and troubleshooting.

Skills

Analytical thinking

Problem solving

Attention to detail

Communication skills

Education

Bachelor's degree in materials science or electrical engineering

Tools

SEM

FIB

TEM

FTIR

EDX

Optical microscope

Job description

Position: PHYSICAL FAILURE ANALYSIS ENGINEER - Bilingual in Korean

Location: COVINGTON, GA

Job Summary

Responsible for performing physical failure analysis of glass substrates. This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures. The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team.

Duties/Responsibilities

• Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniques
• Prepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant features
• Use optical microscopes, electron microscopes, and other imaging tools to examine samples at various scales
• Analyze images to identify defects, fractures, corrosion, and other anomalies
• Analyze data collected from various analyses to develop comprehensive understanding of failure mechanisms
• Generate detailed reports outlining findings, analysis methodologies, and recommendations
• Utilize spectroscopic methods to identify material compositions and elemental distributions
• Perform mechanical and thermal testing
• Prepare reports and documentation of failure analysis results
• Work with other engineers and scientists to develop and improve the failure analysis process
• Participate in quality control procedures, including instrument calibration and performance check
• Troubleshoot technical issues
• Provide support to the OQA function with analysis results

Requirements

• Experiences on SEM / FIB equipments (Analysis tools)
• Proficiency in operating microscopy equipment (optical, SEM, FIB, TEM) and analytical tools (FTIR, EDX)
• Excellent analytical and problem-solving skills to identify root cause of failures
• Strong attention to detail and ability to accurately document findings and observations
• Excellent communication skills and a proven ability to juggle multiple high priority tasks

Qualitifications

• Strong knowledge of electronic devices and their failure mechanisms
• Experience with a variety of failure analysis techniques
• Proficiency in microscopy techniques, material analysis, and spectropy
• Strong understanding of material properties, fracture mechanics, and root cause analysis
• Proficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX)

Education

• Bachelor's degree in material science, electrical engineering, or related field

Experience

• 0+ years of experience in physical failure analysis in electronic or semiconductor applications
• Experience in a Manufacturing Environment

Salary

• $70,000 - $115,000