Failure Analysis Technician - Packaging & SEM/EDX

BC Forward; Chandler (AZ); On-site; USD 39,000 - 55,000; Full time

Benefits offered by this job

Competitive compensation

Growth opportunities

Inclusive culture

Exposure to cutting-edge technologies

Job summary

BCforward is seeking a Technician: Engineering Laboratory - II to join the on-site team in CH5 (Chandler, AZ). The role involves failure analysis of electronic packages and PCBs, with emphasis on X-section polishing and microscopy to understand root causes of failures.

The position requires an AS degree in science or engineering and 2–4 years of related experience, with strong writing and collaboration skills for cross-functional teams.

Qualifications

• AS degree in science or engineering is required.
• 2–4 years in failure analysis, materials analysis, process development, or analytical tool development are expected.
• Hands-on experience with X-section and planar polishing of electronic packages/PCBs, and imaging/analysis techniques.

Responsibilities

• Perform failure analysis on electronic packages and printed circuit boards.
• Execute X-section and planar polishing to prepare samples for analysis.
• Capture and evaluate optical microscopy images to document defects and features.
• Operate SEM/EDX to characterize materials and identify failure mechanisms.
• Collaborate with engineering teams to support root-cause analysis for new package technologies.
• Document findings with clear technical reports and present results as needed.
• Maintain organization, meet deadlines, and deliver under pressure in a team environment.

Skills

X-section polishing

Planar polishing

Optical microscopy

SEM/EDX analysis

Root-cause analysis

Technical writing

Education

AS degree in science or engineering

Tools

SEM/EDX

Optical microscopy

Job description

BCforward is seeking a Technician: Engineering Laboratory - II to join the on-site team in CH5 (Chandler, AZ). The role involves failure analysis of electronic packages and PCBs, with emphasis on X-section polishing and microscopy to understand root causes of failures.

The position requires an AS degree in science or engineering and 2–4 years of related experience, with strong writing and collaboration skills for cross-functional teams.