Package Failure Analysis Engineer - Yield & Fault Diagnostics

Intel; Phoenix (AZ); On-site; USD 85,200 - 139,810; Full time

Job summary

Intel is seeking a College Grad in Phoenix, AZ to support root cause analysis for package yield loss and inline failures. The role involves hands-on lab work, data acquisition and analysis, and collaboration with cross-functional teams to identify corrective actions and improve manufacturing processes.

The position requires a B.S. or higher in a related engineering or physics field, US citizenship, and the ability to obtain TS/SCI with Polygraph.

Qualifications

• Bachelor's degree or higher in Materials Science and Engineering, Mechanical, Chemical, Electrical, or Chemistry and Physics or related field.
• US Citizenship is required.
• Ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
• Hands-on experience with electrical fault isolation or defect characterization techniques.

Responsibilities

• Work across team boundaries to achieve strategic objectives and meet program deliverables.
• Understand and support program milestones and schedules.
• Interface with internal teams to improve yield and drive innovation.
• Conduct hands-on lab work, define data acquisition strategy and data analysis plan, and recommend corrective actions.
• Develop failure analysis techniques and approaches to accelerate failure identification and understanding.
• Consult on packaging and/or assembly problems and improvements in manufacturing.

Skills

Electrical fault isolation

Defect characterization

Lab work

Communication skills

Education

Bachelor's degree in Materials Science, Mechanical, Chemical, Electrical or related field

Tools

Multimeters and probing equipment

TDR, EOTPR, EBAC, RIDR, ELITE

SEM/TEM/XRD/EBSD

Job description

Intel is seeking a College Grad in Phoenix, AZ to support root cause analysis for package yield loss and inline failures. The role involves hands-on lab work, data acquisition and analysis, and collaboration with cross-functional teams to identify corrective actions and improve manufacturing processes.

The position requires a B.S. or higher in a related engineering or physics field, US citizenship, and the ability to obtain TS/SCI with Polygraph.