Digital Failure Analysis Engineer (R&D)

118-WW TMG MFG OPS; Lehi (UT); On-site; USD 90,000 - 130,000; Full time

Job summary

118-WW TMG MFG OPS in Lehi, UT, is seeking an Electrical Failure Analysis (EFA) Engineer to perform electrical investigations on defect, performance, and design issues during technology development to deliver qual-capable, high-yield devices.

You will collect and analyze fault data, characterize failures with bench tests, and collaborate with design, test, and failure analysis teams to identify root causes and improve reliability.

Qualifications

• Bachelor's degree in Electrical Engineering or Electrical and Computer Engineering.
• 5+ years of experience performing electrical failure analysis on semiconductor devices.

Responsibilities

• Failure data analysis and diagnosis: collect and analyze debug data to identify failure signatures and guide root-cause investigation.
• Electrical failure analysis: perform characterization to isolate failing circuitry and determine defect mechanisms.
• Cross-functional debugging and physical correlation: collaborate with design, test, and PFA labs to correlate electrical signatures with physical defects.

Skills

Electrical failure analysis

Data analysis

Cross-functional collaboration

Semiconductor knowledge

Engineering communication

Lab safety

Education

Bachelor's degree in Electrical Engineering or Electrical and Computer Engineering

Tools

Cadence Modus

Synopsys Tetramax

Avalon layouts

Job description

Overview

As an Electrical Failure Analysis (EFA) Engineer, you will perform various electrical investigative work on defect, performance and design-related issues during the technology development phase pertaining to a broad range of products in order to deliver qual-capable and high-yielding devices. This position also requires the ability to develop testing algorithms to successfully segment various electrical failures. You will also be adhering to all lab safety guidelines.

Responsibilities

• Failure Data Analysis and Diagnosis: Collect and analyze debug data from both internal FA test capability and collaboration with Test Engineering using memory mapping and ATPG diagnostic tools to identify failure signatures and guide root-cause investigation.
• Electrical Failure Analysis: Perform electrical failure characterization using production and custom test patterns in a bench test environment to isolate failing circuitry and determine defect mechanisms across wafer yield investigations, qualification issues, quality excursions, and customer returns.
• Cross-Functional Debug and Physical Correlation: Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.

Minimum requirements

• Bachelor's degree in Electrical Engineering or Electrical and Computer Engineering
• 5+ years of experience performing electrical failure analysis on semiconductor devices

Preferred Qualifications

• Strong understanding of semiconductor fabrication processes
• Excellent technical, communication, and analytical skills
• Experience in interpreting SEM/TEM/FIB/EDS/EELS images and analysis results
• Experience in interpreting scan test data and shmoos
• Familiarity with digital circuit operation and scan-based test methodologies
• Experience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentation
• Experience with digital IC design, mixed-signal IC design, or related design environments
• Familiarity with memory mapping tools, ATPG diagnostics like Cadence Modus and Synopsys Tetramax and Avalon layouts
• Ability to work collaboratively across engineering teams including design, test, failure analysis, and manufacturing/process development groups