Equipment Engineer

Skywater Technology; Kissimmee (FL); On-site; USD 90,000 - 150,000; Full time

Job summary

SkyWater Technology, Inc. in Florida is seeking an Equipment Engineer to own and troubleshoot semiconductor processing toolsets across 200MM and 300MM platforms, with a focus on Advanced Packaging processes.

You will lead root-cause actions with process engineering and maintenance, drive continuous improvement, and participate in cross-functional teams to improve yields and capacity, while ensuring compliance as a U.S. Person under ITAR.

Qualifications

• 5–8 years of related experience.
• Experience with High Vacuum and Toxic Gas Delivery systems.
• Experience with applying structured problem-solving methodologies.
• Positive interpersonal skills, highly energetic and self-motivated.
• Outstanding written and verbal communication skills.
• Demonstrated ability to meet requirements and deliver results.
• Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.

Responsibilities

• Lead technical management of 200MM and 300MM semiconductor equipment for Advanced Packaging processes.
• Drive root cause corrective actions for equipment failures and implement permanent solutions.
• Lead continuous improvement teams to improve tool matching, availability and throughput.
• Complete new tool start-up and upgrades to increase fab capability, capacity and yields.
• Work with maintenance, production, and development teams with minimal supervision.
• Participate in cross-functional teams to create efficiencies across the organization.
• The job may include other duties as assigned; time allocations may vary.

Skills

Mechanical engineering

Electrical engineering

Problem solving

Cross-functional collaboration

Communication skills

Project management

Education

Bachelor of Science in Mechanical, Electrical or Chemical Engineering

Tools

High Vacuum Systems

Toxic Gas Delivery systems

Job description

If you are a self-motivated team player, who thrives in a fast-paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you!

Primary Objective:

As an Equipment Engineer you will own all assigned toolsets. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the mechanics, electronics, and process using tool knowledge/experience, SPC, schematics, and other available resources. The candidate will have extensive collaboration with the area maintenance team and process engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.

Responsibilities:

• Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Advanced Packaging processes including Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Singulation, Photolithography, Solder Bumping, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined).
• Work with process engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions and eliminate chronic and long-term down events.
• Lead continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk.
• Complete new tool start-up and tool upgrades to increase fab capability, capacity, lower costs and improve yields.
• Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
• Participate in cross-functional teams that create efficiencies across all layers of the organization.
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications

Education: Bachelor of Science or in Mechanical, Electrical or Chemical Engineering, Materials Science, Physics or other relevant Engineering discipline.

Experience and/or Training:

• 5-8 years of related experience
• Experience with High Vacuum and Toxic Gas Delivery systems.
• Experience with application of structured problem-solving methodology.
• Positive interpersonal skills, highly energetic and self-motivated.
• Outstanding written and verbal communication skills.
• Demonstrated ability to meet requirements and deliver results.
• Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.

U.S. Person Required: SkyWater Technology Foundry, Inc. subject to the International Traffic in Arms Regulations (ITAR). All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.

Preferred Qualifications:

• Experience with wafer/die bonding equipment and/or processes
• Experience with Automated Fault Detection and Classification Systems (FDC).
• Background with utilizing SPC.
• Understanding of equipment component behavior.
• Experience Integrating Equipment Maintenance Management Software