Embedded/Firmware Engineer

CORE Occupational Medicine; Dallas (TX); On-site; USD 110,000 - 160,000; Full time

Job summary

CORE Occupational Medicine seeks a Firmware Engineer in Dallas, TX to design and maintain OBMF-ICP protocol stack, develop USB/MCTP bindings, and lead hardware bring-up onsite.

The role emphasizes embedded C/C++ expertise, OpenBMC experience, and hands-on testing with USB, I2C/SMBus, SPI, and JTAG/SWD; cross-functional collaboration is essential for architecture and validation.

Qualifications

• Expert embedded C, strong C++
• BMC / platform-management firmware experience (OpenBMC strongly preferred)
• DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
• Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
• RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
• Yocto/BitBake, CMake/Meson, Git, CI
• Understanding of I2C/SMBus, SPI, UART, USB, GPIO
• Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics

Responsibilities

• OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
• Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
• Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
• OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
• Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

Skills

Embedded C

C++

OpenBMC

MCTP/PLDM

USB

RTOS Zephyr

Git CI

I2C/SMBus

JTAG/SWD

Tools

CMake

Yocto/BitBake

BitBake

CI/CD

Job description

Job Title: Firmware Engineer

Exp: 6-10 years

Location: Dallas, TX (Onsite)

Key skills

- OCP DC-SCM/DC-MHS, USB

Responsibilities

• OBMF-ICP Protocol Stack: Design, implement, and maintain the OBMF-ICP protocol stack and core protocol components.
• Transport Bindings: Develop and integrate OBMF-ICP transport bindings over USB and MCTP.
• Hardware Bring-up: Lead end-to-end hardware bring-up, including board validation, interface debugging, and firmware readiness.
• OCP Collaboration: Represent the program in OCP working-group discussions, reviews, and technical alignment activities.
• Technical Leadership: Drive architecture, resolve cross-layer issues, and establish implementation and validation best practices.

Experience

6 to 10 years of experience

Requirements

• Expert embedded C, strong C++
• BMC / platform-management firmware experience (OpenBMC strongly preferred)
• DMTF MCTP and PLDM (incl. PLDM firmware update); working knowledge of SPDM
• Hands-on USB, I2C/SMBus, I3C, SPI, UART, GPIO; logic/protocol analyzers, JTAG/SWD
• RTOS (Zephyr/FreeRTOS) and/or embedded Linux on Arm Cortex-M / RISC-V
• Yocto/BitBake, CMake/Meson, Git, CI
• Understanding of I2C/SMBus, SPI, UART, USB, GPIO
• Basic hands-on with logic analyzers, oscilloscopes, JTAG/SWD; can read datasheets and schematics