Electroplating Process Engineer

Qwalifize LLC; Kissimmee (FL); On-site; USD 60,000 - 100,000; Full time

Job summary

An established industry player is seeking a Plating Process Development Engineer to innovate in electroplating and metal etch processes. This role focuses on enhancing advanced packaging technologies and offers the chance to make a significant impact in the US electronics sector. The ideal candidate will have robust experience in process development and integration, with a strong emphasis on collaboration and problem-solving. Join a forward-thinking company that values innovation and offers a comprehensive benefits package, including competitive salary, bonuses, and opportunities for professional growth.

Benefits

Competitive salary

Bonuses

Life insurance

401k match

Discounted company stock

On-site fitness facility

Paid time off

Paid holidays

On-site self-serve market

Qualifications

• 2+ years of experience in electroplating and associated metrology.
• Bachelor's degree in relevant engineering field required.
• Knowledge of DOE, SPC, and 6-sigma concepts.

Responsibilities

• Develop and manage electroplating and wet etch processes.
• Collaborate on advanced packaging solutions integration.
• Monitor SPC charts for trends and process improvements.

Skills

Problem-solving

Data-driven decision making

Communication skills

Process development

Collaboration

Electroplating knowledge

Metrology

Education

Bachelor's Degree in Engineering Physics

Chemical Engineering

Materials Science

Tools

SPC charts

Metrology tools

Job description

Type:

• Direct Hire

Full Time or Part Time:

• Full Time

Pay Rate:

• TBD

Location:

• Kissimmee, FL, 34744

Language Requirements:

• Speak, write, and read English at a professional level

Job Overview:

We are seeking a Plating Process Development Engineer to take responsibility for establishing and managing electroplating and metal wet etch processes at the Florida Advanced Packaging facility. In this position, you will focus on developing and enhancing processes for integrated Advanced Packaging process sequences and cutting-edge Heterogeneous Integration (HI) platform technologies. These include Hybrid Bonding, Direct Bond Interconnect (DBI), 2.5D and 3D Interposer technologies, as well as Fan-Out Wafer Level Packaging (FOWLP). This role offers the opportunity to drive innovation within the US electronics industry. Other duties as assigned.

Experience Requirements:

• Must be subject to the International Traffic in Arms Regulations (ITAR). All accepted applications must be U.S. Persons as defined by ITAR. ITAR defines a U.S. Person as a U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.
• A minimum of 2 years of experience.
• Knowledge of back-end-of-line (BEOL) or front-end-of-line (FEOL) Fab processing tools knowledge/experience in electroplating and associated metrology.
• A minimum of 2 years of experience in MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Clear problem-solving capability, data-driven, inventive solution-oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem-solving.
• New process development and transfer in a manufacturing environment.
• Development of robust manufacturable process recipes for Foundry customers in electroplating (copper, nickel, SnAg, Au) and associated metrology.
• Development of wet etch processes for seed layer strip and etch-back processes.
• Team collaboration on process integration of advanced packaging solutions for platform Heterogeneous Integration technologies and unique customer applications.
• Utilization of metrology tools to characterize and document process results for transfer to production.
• Investigation and implementation of integration changes for improved device performance and yield improvement.
• Collaboration with process integration and tool engineers to identify processing marginalities and implement improvements.
• Routine monitoring of selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by process changes.
• Excellent oral and written communication skills for effective interaction with foundry customers, colleagues, and management.
• Strong problem-solving abilities and data-driven, inventive, solution-oriented thinking.

Education Requirements:

• Bachelor's Degree in Engineering Physics, Chemistry, Chemical Engineering, Electrical Engineering, Materials Science, or equivalent.

Training Schedule:

• TBD

Schedule:

• TBD

Dress Code:

• Business Casual

Benefits:

• Competitive salary along with financial benefits.
• Bonuses.
• Life insurance.
• 401k match.
• Opportunities to purchase company stock at a discounted rate.
• A comprehensive benefits package is provided to promote a healthy lifestyle, featuring benefit eligibility from day one, paid time off, paid holidays, access to an on-site fitness facility, an on-site self-serve market, and much more.

Additional Information:

Drug screening, background and reference checks are performed if required. Valid identification and reliable transportation required. We are an E-Verify employer. We will provide the Social Security Administration (SSA) and, if necessary, the Department of Homeland Security (DHS), with information from each new employee’s Form I-9 to confirm work authorization. Our employees are authorized to work in the United States.