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The Johns Hopkins Applied Physics Laboratory (APL) seeks an Electronics Packaging Engineer to lead the design of electromechanical hardware from concept through delivery, including thermal and structural analysis, detailed design, assembly, and testing. Join a team of engineers and scientists tackling challenges across submarines to spacecraft.
The role requires a BS in mechanical or aerospace engineering, 5+ years of experience, CAD/CAE proficiency (CREO, SolidWorks, ANSYS, FEMAP), and the
The Johns Hopkins Applied Physics Laboratory (APL) seeks an Electronics Packaging Engineer to lead the design of electromechanical hardware from concept through delivery, including thermal and structural analysis, detailed design, assembly, and testing. Join a team of engineers and scientists tackling challenges across submarines to spacecraft.
The role requires a BS in mechanical or aerospace engineering, 5+ years of experience, CAD/CAE proficiency (CREO, SolidWorks, ANSYS, FEMAP), and the