Electromechanical Packaging Engineer

Claros

Torrance (CA)

Hybrid

USD 150,000 - 200,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

100% employer paid health care
Paid maternity/paternity leave
Unlimited PTO
401K and equity incentives

Job summary

Claros in Torrance, CA is seeking an Electromechanical Packaging Engineer to support chip scale packaging design and collaborate across engineering teams. The position requires a minimum of 5 years in microelectronics packaging, proficiency with CAD software, and a willingness to learn. The role offers a robust benefits package including fully paid health care, unlimited PTO, and a salary range of $150,000 to $200,000 depending on experience.

This role fosters career growth and encourages continuous professional development within an innovative and fast-paced team.

Qualifications

  • 5+ years’ experience with microelectronics packaging, and/or PCB design.
  • Knowledge of foundry processes and chip scale assembly processes.
  • Understanding of how electrical design requirements impact substrate layout.

Responsibilities

  • Support chip scale packaging design for integrated voltage regulator product line.
  • Collaborate with substrate layout and manufacturing engineers.
  • Create mechanical drawings for substrate fabrication and packaged part assembly.

Skills

Microelectronics packaging
PCB design
3D mechanical CAD software
Electrical schematics
Thermal analysis

Education

BS in Mechanical or Electrical Engineering
MS or higher-level degree preferred

Tools

Altium
Cadence
Mentor
Creo
NX
Catia

Job description

Claros is a power management solutions company that is innovating at the intersection of power and compute to make AI more sustainable and widely available. By driving down the cost and complexity of power delivery and leveraging innovative hardware and software, the company seeks to decrease energy consumption, optimize power delivery, increase compute performance, and maximize the efficiency of AI operations.

About The Team

We are open‑minded, fast paced, problem solvers that value open dialogue and candor. Our passion is to challenge the status‑quo and we embrace transformational thinking. Our response is never “no, but….” instead “yes, if….”. We are mindful of our personal and organizational blinders and try to build an environment where our team members are at their best.

What You Will Do

The Electromechanical Packaging Engineer will be working with a Lead Engineer and be responsible for:

  • Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line.
  • Collaborate with substrate layout, ASIC design, and manufacturing engineers.
  • Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test.
What You Bring
  • Minimum BS in Mechanical or Electrical engineering, MS or higher‑level degree preferred.
  • 5+ years’ experience with microelectronics packaging, and/or PCB design.
  • Knowledge of foundry processes and chip scale assembly processes.
  • Understanding of how electrical design requirements impact substrate layout and interconnect selection.
  • Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T.
  • Ability to read and create electrical schematics.
  • Familiarity with tape‑out processes for wafers and substrate.
  • Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
  • Willingness to learn new concepts and techniques.
  • Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus.
  • Basic understanding of component‑level thermal analysis is a plus.
  • Willingness to be in the office in Torrance, CA a minimum of 3 days per week.
What We Offer
  • Career track opportunity with potential for rapid advancement with strong performance as the firm grows.
  • 100% employer paid, comprehensive health care including medical, dental, and vision for you and your family.
  • Paid maternity and paternity for 14 weeks at employees' normal pay.
  • Unlimited PTO, with management approval.
  • Opportunities for professional development and continued learning.
  • Optional 401K, FSA, and equity incentives available.
Salary Range

$150,000 – $200,000. This represents the typical salary range for this position based on experience, skills, and other factors.

As set forth in Claros’s Equal Employment Opportunity policy, we do not discriminate on the basis of any protected group status under any applicable law.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Electromechanical Packaging Engineer
Electromechanical Packaging Engineer

Red Cell Partners • Torrance (CA)

Hybrid
USD 150,000 - 200,000
100% employer paid health care
Paid maternity and paternity leave
Unlimited PTO
Senior Electromechanical Packaging Engineer for AI Power
Senior Electromechanical Packaging Engineer for AI Power

Claros • Torrance (CA)

Hybrid
USD 150,000 - 200,000
100% employer paid health care
Paid maternity/paternity leave
Unlimited PTO
+1
Senior Engineering Lab Technician
Senior Engineering Lab Technician

Claros • Los Angeles (CA)

On-site
USD 100,000 - 145,000
Unlimited PTO
Comprehensive health care
Paid maternity and paternity leave
Staff Package Design Engineer
Staff Package Design Engineer

Cirrus Logic, Inc. • Austin (TX)

On-site
USD 100,000 - 130,000
Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal
Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

Eliyan Corporation • San Francisco (CA)

On-site
USD 120,000 - 160,000
Excellent benefits
Fun work environment
Staff Package Design Engineer
Staff Package Design Engineer

Cirrus Logic • Austin (TX)

On-site
USD 100,000 - 130,000
IC Packaging Engineer
IC Packaging Engineer

Vivid Technology • San Jose (CA)

Hybrid
USD 120,000 - 150,000
401(k)
Vision insurance
Medical insurance
+3
Package Engineer
Package Engineer

Entrada Ventures • Palo Alto (CA)

Hybrid
USD 180,000 - 240,000
Equity
Benefits
401k
Packaging Mechanical Engineer
Packaging Mechanical Engineer

DensityAI • Mountain View (CA)

On-site
USD 200,000 - 275,000
Package Engineer
Package Engineer

Delos Data Inc • Palo Alto (CA)

On-site
USD 180,000 - 240,000
Meaningful equity
401k benefits