Staff Package Design Engineer

Cirrus Logic, Inc.; Austin (TX); On-site; USD 100,000 - 130,000; Full time

Job summary

Cirrus Logic, Inc. is looking for a Staff Package Design Engineer in Austin, Texas, to develop advanced packaging solutions for high-performance products. Candidates should hold a relevant engineering degree and have at least 7 years of experience in package design engineering. The role involves collaborating with cross-functional teams, utilizing tools like AutoCAD and Cadence, and promoting automation processes. A strong sense of ownership and effective communication skills are crucial. Join Cirrus Logic to contribute to innovative solutions and grow your career!

Qualifications

• 7+ years of experience in package design engineering or a related role.
• Strong knowledge of packaging technologies and materials.
• Demonstrable experience in a packaging-related field.

Responsibilities

• Collaborate with teams to drive package designs meeting performance and reliability.
• Define package requirements from electrical, thermal, and mechanical perspectives.
• Utilize various tools for physical design and simulation.

Skills

Packaging design experience

AutoCAD proficiency

Electrical simulation understanding

Strong communication skills

Collaborative teamwork

Education

Bachelor's degree in Mechanical, Electrical, Chemical, or Materials Engineering

Tools

Cadence SiP Layout

Siemens Fast 3D

GDS tools

Job description

For over four decades, Cirrus Logic has been propelled by the top engineers in mixed‑signal processing. Our rockstar team thrives on solving complex challenges with innovative end‑user solutions for the world's top consumer brands. Cirrus Logic is also known for its award‑winning culture, which was built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career!

Are you ready to make a significant impact in a fast‑paced, innovative environment?

We are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you’ll work closely with internal and external customers to develop cutting‑edge packaging solutions for high‑performance products including amplifiers, codecs, and DSPs. Our packaging technologies span from traditional wire‑bond QFN to advanced WLCSP and flip‑chip designs.

Responsibilities

• Collaborate with cross‑functional teams to drive package designs that meet Cirrus performance, reliability, and manufacturability requirements
• Define package requirements from electrical, thermal and mechanical point of view in close cooperation with Design and layout teams
• Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information
• Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB
• Work with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages
• Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues
• Grow and promote automation processes throughout the package design flow
• Develop test vehicles that properly assess bump placement, PCB proximity effects, WLCSP RDL stack up and the like on final chip performance
• Close collaboration with customers to resolve various design issues between the piece part and PCB

Required Skills and Qualifications

• BS or above in Mechanical, Electrical, Chemical, or Materials Engineering
• 7+ years of experience in a package design engineering or related role
• Demonstrable experience in a packaging‑related field
• Experienced Cadence SiP layout user
• Strong AutoCAD user
• Knowledge of packaging technologies, materials, package substrate design and assembly rules
• Understanding of electrical simulation results on a package design
• Familiarity or willingness to learn Cadence Virtuoso operation using Unix workstations
• Strong written and verbal communication skills; able to review technical ideas with customers and high‑level management
• Self‑starter with a strong sense of ownership and accountability for driving projects to completion
• Ability to build strong, influential relationships in a collaborative environment within a diverse setting

Preferred Skills and Qualifications

• Conversant with PCB and Die mechanical layout tools (e.g. Siemens Xpedition, Allegro PCB, Cadence Virtuoso)
• Broad reading in the area of interest and the desire to continue that reading with access to the high quality company library resource, material properties knowledge
• Must be broadly curious and knowledgeable, and willing to pursue mastery of new technical concepts through self‑learning or training opportunities available through company resources
• Electrical simulation skills
• Experience using Siemens Fast 3D
• Experience using Siemens Calibre DRV

Export control restrictions based upon applicable laws and regulations would prohibit candidates who are nationals of certain embargoed countries from working in this position without Cirrus Logic first obtaining an export license. Candidates for this role must be able to access technical data without a requirement for an export license. We are unable to sponsor or obtain export licenses for this role.

Cirrus Logic strives to select the best qualified applicant for any opening. Different approaches, ideas and points of view are both valued and respected. Employment decisions are made on the basis of job‑related criteria without regard to race, color, religion, sex, national origin, age, protected veteran or disabled status, genetic information, or any other classification protected by applicable law.