DRAM Process Integration Engineer — Innovate Memory Tech

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Comprehensive medical plans

Paid family leave

Robust paid time-off program

Job summary

A leading semiconductor company is seeking a DRAM Process Integration Engineer in Boise, Idaho. This role entails leading technology integration activities to enhance the manufacturability of cutting-edge 3D DRAM technology. Candidates should possess substantial knowledge in semiconductor device physics and have a proven track record in managing cross-functional teams. Applicants must hold an M.S. or PhD with at least 5 years of relevant experience. Competitive benefits such as medical, dental, and paid time off are offered.

Qualifications

• Proven expertise in mainstream memory technologies like DRAM and NAND.
• Strong understanding of semiconductor process integration.
• Experience in driving cross-functional technical teams.

Responsibilities

• Lead technology integration activities for 3D DRAM technology.
• Engage with cross-functional teams to solve yield issues.
• Optimize process flows and develop solutions for product requirements.

Skills

Semiconductor device physics

Data analysis

Project management

Education

M.S. or PhD in a related field

Tools

Statistical techniques

Job description

A leading semiconductor company is seeking a DRAM Process Integration Engineer in Boise, Idaho. This role entails leading technology integration activities to enhance the manufacturability of cutting-edge 3D DRAM technology. Candidates should possess substantial knowledge in semiconductor device physics and have a proven track record in managing cross-functional teams. Applicants must hold an M.S. or PhD with at least 5 years of relevant experience. Competitive benefits such as medical, dental, and paid time off are offered.