3D DRAM Process Integration Engineer — Innovate Memory Tech

Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off program

Paid family leave

Job summary

A leading semiconductor company in Boise, Idaho seeks a Process Integration Engineer to advance 3D DRAM technology. The role involves optimizing processes, leading cross-functional teams, and driving yield improvements. The ideal candidate will have a strong background in memory technologies, semiconductor device physics, and project management, with a minimum of 5 years of experience. This position offers competitive benefits designed for personal wellbeing and professional growth.

Qualifications

• 5+ years of experience in semiconductor processes.
• Strong background in 3D DRAM technology.
• Ability to analyze and fix yield issues.

Responsibilities

• Lead technology integration for 3D DRAM.
• Optimize process flows and handle R&D experiments.
• Engage with cross-functional teams to solve technical issues.

Skills

Knowledge of memory technologies (DRAM, NAND)

Expertise in semiconductor device physics

Understanding of process integration

Data analysis and statistical techniques

Project management skills

Education

M.S. or PhD in a related field

Job description

A leading semiconductor company in Boise, Idaho seeks a Process Integration Engineer to advance 3D DRAM technology. The role involves optimizing processes, leading cross-functional teams, and driving yield improvements. The ideal candidate will have a strong background in memory technologies, semiconductor device physics, and project management, with a minimum of 5 years of experience. This position offers competitive benefits designed for personal wellbeing and professional growth.