DMTS Process Development Engineer, Advanced Packaging

Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. seeks a veteran organizational leader to guide and influence advanced packaging process development for memory products (HBM, 3DS DRAM, 3D architectures).

You will drive end-to-end technology execution, partner across functions, and shape internal roadmaps and external ecosystems. The role emphasizes data-driven decision-making, AI-enabled tooling, and collaboration with suppliers and R&D to accelerate learning and deliver high-impact solutions.

Qualifications

• MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience).
• 15+ years in semiconductor process development, manufacturing, or advanced packaging.
• Deep expertise in wafer-level or die-level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding.
• Strong understanding of semiconductor process integration and materials interactions.
• Proven experience leading complex cross-functional technical programs.

Responsibilities

• Own advanced packaging process technologies across wafer-level and die-level modules from pathfinding through manufacturing readiness.
• Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs.
• Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning.
• Drive structured problem solving for multi-domain technical challenges and guide strategic decisions across programs.
• Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams.
• Expected to leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.

Skills

Leadership

Data-driven decisions

AI/Advanced analytics

Process development

Cross-functional collaboration

Education

MS in Chemistry, Chemical Engineering, Materials Science, or related field

PhD in a relevant technical field

Job description

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others.

Position Overview:

We are seeking an experienced organizational leader who will lead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration.

Responsibilities:

• Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness
• Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs
• Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning
• Drive structured problem solving for multi‑domain technical challenges and guide strategic decisions across programs
• Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams
• Expected to leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.

Minimum Qualifications:

• MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience)
• 15+ years in semiconductor process development, manufacturing, or advanced packaging
• Deep expertise in wafer‑level or die‑level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding
• Strong understanding of semiconductor process integration and materials interactions
• Proven experience leading complex cross‑functional technical programs

Preferred Qualifications:

• PhD in a relevant technical field
• Extensive experience with advanced memory technologies or 3D packaging architectures
• Experience mentoring other engineers and driving technical methodology improvements
• Familiarity with materials characterization and simulation (thermal, mechanical, electrical)

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here. (http://www.justice.gov/crt/worker-information)

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.