Staff Process Engineer, APTD Bonding

Micron Technology; Boise (ID); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays & family leave

Job summary

Micron Technology in Boise, Idaho is seeking a Process Engineer to join the Advanced Packaging Technology Development (APTD) Bonding team. You will start up, develop, and optimize processes to improve product quality and reliability on packaging lines.

The role emphasizes yield, productivity, cost reduction, and risk management, with problem solving through DOE, SPC, and root-cause analysis, and collaboration with global R&D and manufacturing teams.

Qualifications

• BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience.
• Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products.
• Experience with DOE techniques, SPC, defect analysis and data analysis.
• Experience in semiconductor process engineering and packaging with understanding of process/equipment interactions.
• Ability to resolve sophisticated issues through root-cause or model-based problem solving.

Responsibilities

• Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods.
• Identify, diagnose, and resolve assembly process related problems.
• Coordinate and complete process, equipment, and material evaluation/optimization initiatives and implement changes at process step.
• Validate and fan out new process baseline qualified for new product introduction.
• Support SPC/FDC/RMS/APC and site-to-site portability.
• Audit material suppliers to achieve quality, cost and risk management objectives.

Skills

Process engineering

DOE techniques

SPC

Root-cause analysis

Packaging knowledge

Education

BS in Materials Science or related field

Tools

FMEA

8D problem solving

Statistical analysis

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

Position Overview

As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities

• Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods
• Identify, diagnose, and resolve assembly process related problems
• Coordinate and complete process, equipment, and material evaluation / optimization initiatives and implement changes at process step
• Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction
• Support SPC/FDC/RMS/APC, and site-to-site portability
• Audit material suppliers to achieve quality, cost and risk management objectives

Minimum Qualifications

• BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics + 5 years of relevant industry experience
• Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products
• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), defect analysis and data analysis
• Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions
• Ability to resolve sophisticated issues through root-cause or model-based problem solving and adjust to shifting responsibilities and needs of the team.

Preferred Qualifications

• MS or PHD in Materials Science, Chemical Engineering, Electrical Engineering, or Mechanical Engineering
• Experience leading project teams and providing leadership updates
• Experience building relationships with suppliers/vendors

Benefits

• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.