Digital Failure Analysis Engineer (R&D)

Texas Instruments; Lehi (UT); On-site; USD 90,000 - 130,000; Full time

Job summary

Texas Instruments in Utah is seeking an Electrical Failure Analysis (EFA) Engineer to perform electrical investigative work on defect, performance and design issues during technology development, delivering qual-capable and high-yielding devices. You will also develop testing algorithms to segment electrical failures and adhere to lab safety guidelines.

Responsibilities include collecting and analyzing debug data from FA test capability and collaborating with Test Engineering to identify failure

Responsibilities

• Failure Data Analysis and Diagnosis: Collect and analyze debug data from both internal FA test capability and collaboration with Test Engineering using memory mapping and ATPG diagnostic tools to identify failure signatures and guide root-cause investigation.
• Electrical Failure Analysis: Perform electrical failure characterization using production and custom test patterns in a bench test environment to isolate failing circuitry and determine defect mechanisms across wafer yield investigations, qualification issues, quality excursions, and customer returns.
• Cross-Functional Debug and Physical Correlation: Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.

Job description

About the job

As an Electrical Failure Analysis (EFA) Engineer, you will perform various electrical investigative work on defect, performance and design-related issues during the technology development phase pertaining to a broad range of products in order to deliver qual-capable and high-yielding devices. This position also requires the ability to develop testing algorithms to successfully segment various electrical failures. You will also be adhering to all lab safety guidelines.

Key Responsibilities

• Failure Data Analysis and Diagnosis: Collect and analyze debug data from both internal FA test capability and collaboration with Test Engineering using memory mapping and ATPG diagnostic tools to identify failure signatures and guide root-cause investigation.


• Electrical Failure Analysis: Perform electrical failure characterization using production and custom test patterns in a bench test environment to isolate failing circuitry and determine defect mechanisms across wafer yield investigations, qualification issues, quality excursions, and customer returns.


• Cross-Functional Debug and Physical Correlation: Work with Test Engineering, design teams, and Physical Failure Analysis (PFA) laboratories to correlate electrical failure signatures with physical defects and enable defect isolation.