Failure Analysis Engineering Aide

Analog Group; Rhode Island; On-site; USD 80,000 - 110,000; Full time

Job summary

A leading company in the semiconductor industry is seeking a skilled Failure Analysis Engineer with over 5 years of experience. The ideal candidate will utilize advanced failure analysis techniques to identify issues in ICs and PCBs, while collaborating with cross-functional teams to deliver timely solutions. Strong technical skills and an associate degree in Electronics are essential for success in this role.

Qualifications

• 5+ years of relevant Failure Analysis experience in semiconductor or PCB industry.
• Familiar with IC packaging and PCB manufacturing.
• Experience in ISO-9001 work environment is a plus.

Responsibilities

• Conduct root-cause analysis of products using failure analysis techniques.
• Support Failure Analysis Engineers and solve problems with cross-functional teams.
• Communicate analysis results through formal technical report writing.

Skills

Physical failure analysis techniques

Troubleshooting electrical failures

Attention to detail

Interpersonal skills

Education

Associate degree or technical certification in Electronics

Tools

Optical and scanning electron microscopes

Electrical test equipment

MS Word

Excel

Job description

• Provides timely and accurate root-cause analysis of products (IC’s, System-in-Package, and filters) using electrical and physical failure analysis techniques.
• Supports Failure Analysis Engineers and works with cross-functional teams (Manufacturing, Quality, Reliability, Design, etc.) to solve problems arising from customer returns, process anomalies, engineering evaluations, and new product development.
• Communicates analysis results through formal, technical report writing.
• Collaborates with internal and external laboratories as needed.
• Meets failure analysis cycle-time requirements.

Critical knowledge and abilities:

• Strong knowledge and experience utilizing physical failure analysis techniques for IC’s and PCB’s including cross-sectioning, parallel lapping, Reactive Ion Etching, decapsulating, X-ray analysis and chemical deprocessing.
• Experience utilizing optical and scanning electron microscopes including EDX (Energy Dispersive X-ray) analysis.
• Ability to troubleshoot electrical failures by micro-probing and using electrical test equipment.
• Adept at I/V curve-tracing using analog and multi-pin, digital curve tracers (RTI).
• Experience building evaluation boards by interpreting schematics and soldering components.
• Demonstrated proficiency utilizing MS Word, Excel, photo-editing, schematic and IC layout software.
• Familiar with FA techniques in order to effectively direct external lab’s: EMMI, FIB, CSAM, OBIRCH, TIVA, LIVA, etc.
• Able to write concisely using good spelling, grammar, and proofreading skills.
• Must be highly organized with a strong attention to detail. Must be able to manage multiple, concurrent assignments under tight deadlines.
• Able to follow instructions, maintain priorities, and make good decisions with minimal supervision.
• Has an FA mindset understanding FA processes, flow, and decision tree.
• Familiar with IC packaging, semiconductor processes, and PCB manufacturing.
• Experience working within an ISO-9001 work environment is a plus.

Qualifications:

• 5+ years of relevant Failure Analysis experience in the semiconductor or PCB industry.
• Associate degree or technical certification in Electronics.
• Excellent interpersonal and communications skills.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability or protected veteran status.