Remote EUV Thin Film Process Engineer

Micron Technology, Inc; Boise (ID); Remote; USD 107,000 - 182,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid family leave

Job summary

Micron Technology, Inc. is seeking a Thin Films Process Development Engineer located in Boise, Idaho. In this role, you will develop deposition processes for next-generation DRAM technology, focusing on EUV patterning films. Ideal candidates should hold a PhD or MS with semiconductor experience and have a solid foundation in materials science. Responsibilities include optimizing processes, leading defect reductions, and collaborating with various teams. Competitive salary range of $107,000 to $182,000 annually, with additional benefits offered.

Qualifications

• PhD or MS with 4+ years of semiconductor experience in materials or process development.
• Hands-on experience with patterning films such as photoresist.
• Knowledge of SPC and process maturity.

Responsibilities

• Develop and transfer thin film deposition processes for EUV-enabled DRAM technology.
• Lead process characterization and defect reduction initiatives.
• Collaborate with internal teams and suppliers.

Skills

Semiconductor experience

Materials science

Thin film physics

EUV patterning knowledge

Process troubleshooting

Education

PhD or MS in related field

Tools

ALD

CVD

PECVD

LPCVD

Job description

Micron Technology, Inc. is seeking a Thin Films Process Development Engineer located in Boise, Idaho. In this role, you will develop deposition processes for next-generation DRAM technology, focusing on EUV patterning films. Ideal candidates should hold a PhD or MS with semiconductor experience and have a solid foundation in materials science. Responsibilities include optimizing processes, leading defect reductions, and collaborating with various teams. Competitive salary range of $107,000 to $182,000 annually, with additional benefits offered.