Die-to-Die (D2D) Applications Engineer

Broadcom

Fort Collins (CO)

On-site

USD 91,000 - 146,000

Full time

5 days ago
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Job summary

Broadcom's ASIC Product Division (APD) seeks a Die-to-Die (D2D) Applications Engineer to be the primary technical resource for integrating and deploying our D2D PHY IP in silicon. This role bridges hardware, firmware, and software across RTL, simulation, bring-up and production.

You will develop expert knowledge of the D2D PHY architecture and become the go-to engineer for solving cross-domain integration and debug challenges, supporting internal teams and external customers with guidance and

Qualifications

  • Bachelor’s degree in Electrical/Computer Engineering or equivalent, with 5+ years experience; or Master’s with 3+ years.
  • Hands-on Verilog simulation debugging experience.
  • Debug skills across RTL, firmware, embedded software, or system-level hardware.
  • Ability to trace issues from software/firmware to hardware/RTL root causes.
  • Solid understanding of digital design fundamentals and chip-level interfaces.
  • Strong communication to explain complex issues to engineers and customers.
  • Self-directed with comfort solving ambiguous debug problems.
  • Scripting skills (Python, Ruby, Tcl) for debug automation and log analysis.
  • Familiarity with embedded firmware development or debug in C/C++.

Responsibilities

  • Provide hands-on technical support to customers integrating D2D PHY IP.
  • Debug and resolve Verilog/RTL simulation issues during integration.
  • Support DFT and ATE production test development with PHY guidance.
  • Assist customers with silicon bring-up, characterization and test support.
  • Triage firmware questions and diagnose cross-layer issues.
  • Identify root causes across RTL, firmware and system boundaries.
  • Develop expertise on D2D PHY architecture and operation.
  • Create internal docs, guides and notes from recurring issues.
  • Collaborate with design, verification, firmware, product engineering and DFT/test teams.

Skills

Verilog debugging
RTL/digital logic
Firmware/debug
Embedded software
System-level hardware
Python scripting
Ruby scripting
Tcl scripting
Debug automation

Education

Bachelor's Degree in Electrical or Computer Engineering
Master's degree

Tools

Oscilloscopes
Logic analyzers
Protocol analyzers
On-chip debug tools

Job description

Job Description

Broadcom’s ASIC Product Division (APD) is focused on enabling customers to develop products with a sustainable and substantial competitive advantage. APD does this by delivering best-in-class technology platforms, easy-to-integrate bleeding-edge intellectual property, and by providing world-class customer support. APD’s customers span a wide range of industries developing ASICs for the largest and most complex cloud computing AI engines, supercomputers, networking, and advanced wireless solutions.

Job Description

Broadcom’s ASIC Product Division (APD) is focused on enabling customers to develop products with a sustainable and substantial competitive advantage. APD does this by delivering best-in-class technology platforms, easy-to-integrate bleeding-edge intellectual property, and by providing world-class customer support. APD’s customers span a wide range of industries developing ASICs for the largest and most complex cloud computing AI engines, supercomputers, networking, and advanced wireless solutions.

We are seeking a Die-to-Die (D2D) Applications Engineer to serve as the primary technical resource for internal and external customers integrating and deploying our proprietary D2D PHY IP in silicon. This role bridges hardware, firmware, and software, providing deep technical support across the full IP lifecycle — from RTL integration and simulation through silicon bring-up and production. You will develop expert-level knowledge of our D2D PHY architecture (hardware and software/firmware) and become the go-to engineer for solving complex, cross-domain integration and debug challenges.

While prior D2D PHY experience is a strong plus, we place equal or greater weight on candidates who are exceptional at root-causing hard problems that span RTL, firmware, and system-level interactions.

Responsibilities
  • Provide hands-on technical support to internal and external customers integrating the D2D PHY IP into their ASIC and products
  • Debug and resolve Verilog/RTL simulation issues encountered during customer integration
  • Support internal DFT (Design-for-Test) and ATE (Automated Test Equipment) production test development teams with PHY-specific technical guidance
  • Assist external customers with silicon bring-up, characterization, and production test/debug support
  • Triage and resolve firmware-related issues and questions from customers using the PHY’s embedded software/firmware stack
  • Diagnose issues that span multiple layers — RTL, firmware, and system/software — and identify root cause across hardware/software boundaries
  • Develop and maintain deep expertise in the architecture, functionality, and operation of the proprietary D2D PHY (hardware and software)
  • Create and improve internal documentation, debug guides, and application notes based on recurring customer issues
  • Work cross-functionally with design, verification, firmware, product engineering, and DFT/test teams to elevate and close out issues
  • Participate in customer-facing technical discussions, including simulation reviews, bring-up sessions, and post-silicon debug
Required Qualifications
  • A Bachelor’s Degree in Electrical or Computer Engineering or equivalent, and 5+ years of related experience; or Masters degree and 3+ years of related experience
  • Demonstrated hands-on experience running and debugging Verilog simulations
  • Strong debugging skills across at least two of the following domains: RTL/digital logic, firmware, embedded software, or system-level hardware
  • Comfort working at the intersection of hardware and software — able to trace an issue from a software/firmware symptom down to a hardware or RTL root cause (or vice versa)
  • Solid understanding of digital design fundamentals and standard chip-level interfaces/protocols
  • Strong communication skills, with the ability to explain complex technical issues clearly to both internal engineering teams and external customers
  • Self-directed and comfortable owning ambiguous, open-ended debug problems
  • Scripting skills (Python, Ruby, Tcl) for debug automation and log analysis
  • Familiarity with embedded firmware development or debug (C/C++, register-level debug, on-chip debug tools)
Preferred Qualifications
  • Direct experience with Die-to-Die (D2D) PHY IP, chiplet interconnects, or other high-speed SerDes/PHY IP
  • Experience with silicon bring-up, lab debug equipment (oscilloscopes, logic analyzers, protocol analyzers), and characterization
  • Experience supporting DFT and/or ATE test development (scan, BIST, test pattern debug)
  • Prior experience in an applications engineering, field applications engineering (FAE), or customer-facing technical support role
What Success Looks Like
  • Customers (internal and external) view you as a trusted, responsive technical resource for D2D PHY integration and debug
  • Simulation and bring-up issues are triaged quickly and routed to root cause efficiently, whether the issue lives in RTL, firmware, or system integration
  • Internal DFT/ATE teams get the PHY-specific support they need to develop robust test coverage
  • Recurring issues are captured and turned into documentation that reduces future support burden
Compensation And Benefits

The annual base salary range for this position is USD 91,100.00 To USD 146,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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