Data Center Reliability Engineer: HPC Motherboards & SoC

Apple Inc.

Austin, Northern (TX, KY)

Hybrid

USD 150,000 - 190,000

Full time

14 days+
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Job summary

Apple Inc. is seeking a highly analytical Reliability Engineer to shape the reliability strategy for next-gen data center motherboards. You will bridge component to system-level availability, drive physics-of-failure studies, and use advanced modeling to ensure uptime in a demanding data center environment.

You will lead cross-functional teams, translate system requirements into component specs, and develop rigorous test plans to validate reliability across HPC servers.

Qualifications

  • BS in a relevant engineering field with 5+ years of experience.
  • Proficiency in statistical life data analysis and reliability concepts.
  • Knowledge of package integration, SLI reliability, PCB reliability, bonding materials, and warpage control.
  • Ability to apply FMEA methodologies and communicate complex statistics clearly.
  • Experience managing multiple projects in a fast-paced environment.

Responsibilities

  • Lead the board-level reliability strategy for HPC motherboards and servers.
  • Use FMEA to identify and mitigate failure modes early in design.
  • Apply physics-of-failure to analyze packages, SLI, and PCB materials.
  • Develop reliability models (RBDs, Markov, Bayesian) to quantify risk.
  • Translate availability requirements into design targets and validation criteria.
  • Design and execute Mechanical, Environmental, and ALT test plans.
  • Drive RCA and perform statistical analysis to measure design maturity.

Skills

Reliability engineering
Statistical life data analysis
FMEA
Semiconductor package integration
Board-level reliability
Cross-functional collaboration
Strong communication

Education

Bachelor's in Materials Science / Electrical / Mechanical Eng or equivalent
MS/PhD in Reliability or related field

Tools

Weibull++
BlockSim
JMP
Minitab
Python
R
MATLAB

Job description

Apple Inc. is seeking a highly analytical Reliability Engineer to shape the reliability strategy for next-gen data center motherboards. You will bridge component to system-level availability, drive physics-of-failure studies, and use advanced modeling to ensure uptime in a demanding data center environment.

You will lead cross-functional teams, translate system requirements into component specs, and develop rigorous test plans to validate reliability across HPC servers.

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