Cryogenic TSV Engineer for Quantum Packaging

GlobalFoundries; New York (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries Fab8 is seeking a highly skilled R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.

The successful candidate will collaborate with materials, device, and packaging teams to drive end-to-end TSV flows, prototype builds, and the transition from R&D to pilot and manufacturable processes in a fast-paced semiconductor

Qualifications

• Master's degree in a relevant engineering field with strong academic record.
• MS degree with at least 8 years of related work experience.
• English fluency (written and verbal).
• Travel up to 20%.

Responsibilities

• Lead development of TSV processes for cryogenic and superconducting applications.
• Define TSV architectures including superconducting liners, dielectric isolation schemes, via geometries.
• Own end-to-end TSV integration flows across etch, liner deposition, dielectric, metallization, thinning, reveal, and packaging stacks.
• Drive process integration planning to enable prototyping and qualification across programs.
• Develop TSV solutions for superconducting interposers and 3D integration platforms.

Skills

English proficiency

Education

Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field

Job description

GlobalFoundries Fab8 is seeking a highly skilled R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.

The successful candidate will collaborate with materials, device, and packaging teams to drive end-to-end TSV flows, prototype builds, and the transition from R&D to pilot and manufacturable processes in a fast-paced semiconductor