Quantum Cryogenic Interconnect Architect

GLOBALFOUNDRIES U.S. INC.; New York (NY); On-site; USD 143,000 - 247,000; Full time

Job summary

GlobalFoundries Fab8 is seeking an experienced R&D interconnect and interposer integration engineer to lead development and integration of cryogenic, superconducting interconnect and interposer technologies for scalable quantum system integration.

The role focuses on end-to-end interposer and interconnect flows, 2.5D/3D architectures, and defining low-loss routing for cryogenic operation. Travel up to 20% may be required.

Qualifications

• Master’s degree in Electrical, Mechanical, Chemical Engineering, Materials Science or related field from an accredited program.
• MS degree with at least 10 years of related work experience.
• English language proficiency (written & verbal).
• Travel up to 20%.

Responsibilities

• Lead development of superconducting interconnect and interposer integration processes (e.g., Nb, Al, In, superconducting liners, redistribution layers).
• Develop 2.5D and 3D cryogenic interposer architectures for quantum systems.
• Define routing, metallization, and integration schemes optimized for low-loss RF/microwave propagation, minimal thermal leakage, and cryogenic reliability.
• Own end-to-end integration of interposer and interconnect flows across wafer-level and die-level integration stages.
• Architect and integrate multi-die quantum packaging solutions (qubit die + control electronics, superconducting interposers).
• Translate system requirements into interconnect density, pitch, and routing specs.
• Enable early-stage prototyping lots and ensure smooth fab/assembly execution.
• Support transition to manufacturable, scalable flows and collaborate with OSATs and suppliers.

Skills

Cryogenic interconnect

3D integration

Quantum packaging

Process integration

Team collaboration

Education

Master’s in Electrical/Mechanical/Chemical Engineering or Materials Science

PhD preferred with 8+ years' experience

Job description

GlobalFoundries Fab8 is seeking an experienced R&D interconnect and interposer integration engineer to lead development and integration of cryogenic, superconducting interconnect and interposer technologies for scalable quantum system integration.

The role focuses on end-to-end interposer and interconnect flows, 2.5D/3D architectures, and defining low-loss routing for cryogenic operation. Travel up to 20% may be required.