Cryogenic Quantum Bump Engineer

GlobalFoundries; Essex (MD); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries is hiring a Quantum Bump Integration Engineer in Essex Junction. Responsibilities include leading the development of next-generation interconnect technologies and optimizing bump structures for quantum systems.

The ideal candidate will hold a Master’s degree in Engineering and have 8+ years of relevant experience. You will collaborate with device engineers and vendors to support scalable quantum hardware packaging.

Qualifications

• Master’s degree in a relevant field from an accredited program.
• 8+ years of related work experience or PhD with at least 5 years experience.
• In-depth knowledge of BEOL processes.

Responsibilities

• Lead development of cryogenic-compatible bump interconnect technologies.
• Define and optimize bump structures and process flows.
• Ensure process robustness for pilot/high-volume manufacturing.

Skills

Problem solving

Technical troubleshooting

Project management

Strong communication skills

Education

Master’s in Electrical Engineering

PhD preferred

Job description

GlobalFoundries is hiring a Quantum Bump Integration Engineer in Essex Junction. Responsibilities include leading the development of next-generation interconnect technologies and optimizing bump structures for quantum systems.

The ideal candidate will hold a Master’s degree in Engineering and have 8+ years of relevant experience. You will collaborate with device engineers and vendors to support scalable quantum hardware packaging.