Cryogenic Interposer Design & Integration Engineer

HRL Laboratories, LLC; Malibu (CA); On-site; USD 173,000 - 222,000; Full time

Benefits offered by this job

Medical, dental, vision

401K match

PTO & sick time

Gym facilities

Job summary

HRL Laboratories, an IBM company, seeks an Interposer System Design Analyst & Integration Engineer to model and validate thermal and mechanical behavior of superconducting interposers in cryogenic environments. You will develop metrology plans, run multi-physics simulations, and translate results into actionable design guidance.

The ideal candidate has strong FEM and cryogenic modeling experience, hands-on test expertise, and excellent communication to collaborate with engineering teams across

Qualifications

• BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Physics, or a related field with 5+ years of relevant experience.
• Expertise with thermal and mechanical FEM modeling tools (e.g., ANSYS, COMSOL, Abaqus) and the ability to design and execute complex simulations.
• Extensive hands on experience with mechanical or thermal test methods, including fixture design, instrumentation, and interpretation of low temperature measurements.
• Familiarity with CAD tools used to construct detailed 3D models and simulation geometries.
• Deep understanding of materials used in superconducting interposers, including silicon, glass, and metal based structures.
• Experience modeling material behavior at very low temperatures and addressing the challenges associated with deep cryogenic simulations (mK–4 K).
• Strong communication skills, with the ability to present modeling assumptions, results, and recommendations to senior stakeholders as well as collaborating effectively with engineering partners.
• Strong analytical and problem solving skills, including the ability to reconcile measured data with simulation outputs.

Responsibilities

• Develop and execute detailed thermal and mechanical finite element models to evaluate the behavior of superconducting interposers and associated packaging structures across cryogenic temperature ranges.
• Build complex geometric and material models using CAD tools; generate mesh strategies, boundary conditions, and multi physics simulations appropriate for deep cryo operation.
• Collaborate with teams performing relevant thermal and mechanical measurements to validate FEM predictions, characterize material responses, and identify discrepancies between modeled and measured behavior.
• Analyze superconducting interposer materials—including silicon based, glass based, and hybrid architectures—to determine stress distributions, thermal gradients, and deformation behaviors at very low temperatures.
• Work collaboratively with process, packaging, and device engineering teams to ensure system level design choices align with cryogenic performance requirements and manufacturing constraints.
• Document simulation methodologies, material models, assumptions, and validation results while contributing to design reviews and cross functional integration discussions.
• Communicate technical findings, risks, and design implications clearly to senior management and collaborate with team members to drive data informed engineering decisions.
• Support development of cryogenic reliability strategies, including interface behavior, material compatibility, and failure mode mitigation informed by modeling outcomes.

Skills

FEM modeling

Thermal analysis

Mechanical analysis

Low-temperature modeling

Communication skills

Education

BS/MS/PhD in EE/ME/Physics

Tools

ANSYS

COMSOL

Abaqus

CAD software

Job description

HRL Laboratories, an IBM company, seeks an Interposer System Design Analyst & Integration Engineer to model and validate thermal and mechanical behavior of superconducting interposers in cryogenic environments. You will develop metrology plans, run multi-physics simulations, and translate results into actionable design guidance.

The ideal candidate has strong FEM and cryogenic modeling experience, hands-on test expertise, and excellent communication to collaborate with engineering teams across