Co-Packaged Optics Systems Engineer for AI Infra

Corning Inc.; Illinois; On-site; USD 120,000 - 160,000; Full time

Job summary

Corning is seeking a Systems Engineer, Co-Packaged Optics to work directly with customers and ecosystem partners, translating requirements into robust CPO solutions and guiding design-in through production.

You will combine deep technical expertise in semiconductor manufacturing and photonic connectivity with a strong customer-facing orientation to shape AI infrastructure in hyperscale data centers, collaborating with R&D, PLM, and marketing.

Qualifications

• Master's or Doctorate Degree in Physics, Electrical, Optical or Mechanical Engineering, or equivalent fields.
• 7+ years of experience in an applications, systems, or product development function, with meaningful time in a customer-facing technical role (Systems Engineer, Applications Engineer, Scientist, or Solutions Architect).
• Participation in complex projects and contribution to multi-functional teams in a fast-paced competitive environment.
• Deep understanding of optics, glass as a material, optical fiber and communications, Silicon Photonics, semiconductor packaging, semiconductor metrology, electronic hardware design and manufacturing.
• Fluent English, verbally and written.

Responsibilities

• Serve as a primary technical point of contact for strategic customers and ecosystem partners throughout the CPO product lifecycle - from early architecture discussions through design-in, qualification, and deployment.
• Lead product and system ideation with our customers and partners, with the goal of addressing identified needs through differentiated product offerings.
• Translate customer requirements into internal product specifications, ensuring alignment between external needs and Corning's R&D and product development capabilities.
• Conduct feasibility studies and develop initial design concepts to be transferred to R&D.
• Establish ongoing and trusting relationships with technical counterparts amongst our primary customers and partners within the CPO ecosystem.
• Develop a deep understanding of customer applications, the systems in which they operate, and how Corning products function in these applications.
• Lead technical deep-dive sessions, architecture workshops, and design reviews with customer engineering teams, including hyperscaler network architects and ASIC/platform engineers.
• Perform system level thermo-mechanical simulations to provide design recommendations.
• Deliver compelling technical presentations, demos, and proof-of-concept (PoC) engagements.
• Participate in mapping out market trends and technology roadmaps, identifying key gaps and recommendations in terms of both technology capabilities and new products.
• In close collaboration with PLM and Marketing, help refine Corning's value proposition in the context of a deep understanding of the applications and use cases of our CPO solutions

Skills

Photonic connectivity

Semiconductor manufacturing

Systems engineering

Customer engagement

Product development

CPO architectures

Optical engineering

AI/ML architectures

English fluency

Industrial experience

Education

Master's/PhD in engineering

Tools

PLM

Job description

Corning is seeking a Systems Engineer, Co-Packaged Optics to work directly with customers and ecosystem partners, translating requirements into robust CPO solutions and guiding design-in through production.

You will combine deep technical expertise in semiconductor manufacturing and photonic connectivity with a strong customer-facing orientation to shape AI infrastructure in hyperscale data centers, collaborating with R&D, PLM, and marketing.