Cloud Hardware Engineer: Rack Subsystem & Thermal Design

Amazon Inc.; Seattle, Northern (WA, KY); Hybrid; USD 136,000 - 184,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

Job summary

Amazon is seeking a Cloud Hardware Development Engineer for the Hardware Engineering Services group in Seattle. You will lead mechanical/thermal design for rack sub-systems, collaborating with HW and SW teams to deliver high-performance, cost-effective cloud hardware.

The role requires hands-on experience with thermal analysis tools and 3D CAD, plus the ability to communicate effectively across global teams and suppliers. Expect a fast-paced environment with high standards.

Qualifications

• Bachelor's degree in mechanical engineering or equivalent.
• 2 years of thermal and mechanical design experience on server technologies or equivalent.

Responsibilities

• Design rack sub-systems and associated components (frame, rails, chassis, air dams).
• Validate subsystems meet NP I program requirements.
• Collaborate with HW/SW teams to develop optimized integrated solutions.
• Conduct failure analysis and solution validation.
• Coordinate with overseas resources.
• Provide technical mentorship and design reviews to engineers.

Skills

Thermal/Mechanical design

Server technologies

Problem solving

Communication

Education

Bachelor's degree in mechanical engineering

Master's degree preferred

Tools

Flotherm/ANSYS Icepak

SolidWorks/Creo

Job description

Amazon is seeking a Cloud Hardware Development Engineer for the Hardware Engineering Services group in Seattle. You will lead mechanical/thermal design for rack sub-systems, collaborating with HW and SW teams to deliver high-performance, cost-effective cloud hardware.

The role requires hands-on experience with thermal analysis tools and 3D CAD, plus the ability to communicate effectively across global teams and suppliers. Expect a fast-paced environment with high standards.