AVP, Co-Packaged Optics & Photonic Systems

PER International; California (MO); On-site; USD 180,000 - 270,000; Full time

Job summary

PER International represents a major global semiconductor company in the San Jose Bay Area seeking a senior system-level architect for a Co-Packaged Optics program. The role will own architecture across the full optical interconnect stack, from concept through high-volume manufacturing.

The ideal candidate will have deep experience with Co-Packaged Optics, Silicon Photonics, and system-level packaging decisions, leading multi-disciplinary teams across locations in the US and Taiwan.

Qualifications

• Deep experience with Co-Packaged Optics and optical I/O for data center or AI infrastructure projects.
• Strong understanding of Silicon Photonics, PIC design, and PIC-plus-EIC integration including drivers, TIAs, SerDes, and DSP.
• Track record of taking optical/photonic hardware from architecture through volume production.
• Experience with advanced packaging, heterogeneous integration, and system-level consequences of packaging decisions.
• Hands-on technical leadership with ability to lead multi-disciplinary engineering teams.

Responsibilities

• Define system-level optical architecture for CPO and optical I/O around advanced compute silicon.
• Make architectural trade-offs across PIC, EIC, lasers, packaging, and optical link subsystems.
• Direct and mentor specialist leads in photonic IC, packaging, validation, and firmware areas.
• Drive architecture decisions from concept through EVT, DVT, qualification, to high-volume manufacturing.
• Collaborate across US and Taiwan engineering teams and with senior executives and ecosystem partners.

Skills

Co-Packaged Optics

PIC design

Silicon Photonics

System architecture leadership

Packaging & integration

Job description

PER International represents a major global semiconductor company in the San Jose Bay Area seeking a senior system-level architect for a Co-Packaged Optics program. The role will own architecture across the full optical interconnect stack, from concept through high-volume manufacturing.

The ideal candidate will have deep experience with Co-Packaged Optics, Silicon Photonics, and system-level packaging decisions, leading multi-disciplinary teams across locations in the US and Taiwan.