ATD MIHL Equipment Development Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 99,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation in Phoenix, AZ seeks a Packaging Module Development Engineer to advance assembly and packaging technologies. You will develop processes and equipment to improve efficiency, reliability, and quality across next‑generation packaging solutions.

Responsibilities include applying DOE and SPC, designing reusable test equipment, and ensuring manufacturability of layouts while driving continuous improvement in workflows and supplier collaboration. On‑site role in Phoenix.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field.
• 3+ years of relevant experience (or 2+ years with a Master’s/PhD).
• Experience with SPC and DOE principles.

Responsibilities

• Develop and optimize assembly processes and equipment to meet quality, yield, and cost goals.
• Apply DOE and SPC to refine processes and document findings in technical reports.
• Design and maintain equipment to test packaging technologies under temperature, humidity, and stress.
• Ensure manufacturability of layouts and oversee manufacturing workflows lifecycles.
• Collaborate with supplier quality and procurement to meet performance benchmarks.

Skills

SPC

DOE

SolidWorks

AutoCAD

GD&T

Education

Bachelor's degree

Master's degree

PhD

Tools

SolidWorks

AutoCAD

Job description

## ATD MIHL Equipment Development EngineerApply: US, Arizona, Phoenix: Full time: Posted Today: JR0288501# **Job Details:**## Job Description:**The Role and Impact** Join Intel's Packaging Module Development team as a Packaging Module Development Engineer and contribute to advancing innovative assembly and packaging technologies. In this role, you will develop and optimize processes and equipment to support next-generation packaging solutions. Your work will directly enhance manufacturing efficiency, product reliability, and quality, enabling cutting-edge products that shape Intel's leadership in the semiconductor industry. **Business Group** Intel's Packaging Module Development team focuses on designing and refining assembly and packaging solutions for Intel's diverse product portfolio. Collaborating with cross-functional teams, this group drives innovation in manufacturing processes and delivers high-quality, reliable solutions that support Intel's mission to deliver world-class technologies to global markets. **Key Responsibilities*** Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals.* Apply principles of Design of Experiments (DOE) and Statistical Process Control (SPC) to refine processes and specifications, documenting findings through technical reports.* Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as temperature cycles, humidity, heat, and dynamic forces.* Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.* Define material specifications and collaborate with supplier quality and procurement teams to ensure adherence to quality and performance benchmarks.* Innovate new techniques, tools, and quality screens to proactively identify and address packaging reliability challenges.* Set reliability benchmarks based on a thorough understanding of failure mechanisms and customer needs.* Lead problem-solving initiatives and drive continuous improvement in processes and equipment.* Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.* Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks.## **Qualifications:****This position is not eligible for Intel immigration sponsorship.****Minimum Qualifications*** Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 3+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 2+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field. Experience in the following:* Statistical Process Control (SPC) and Design of Experiments (DOE) principles.* Mechanical design software, such as SolidWorks or AutoCAD.* Mechanical drawings, Geometric Dimensioning, and Tolerancing principles.**Preferred Qualifications** Experience in the following:* Program management ability to lead technical innovation and manage complex, time-sensitive projects.* Semiconductor fabrication processes, packaging technologies, and robotics.* Supply chain management in a manufacturing or materials qualification environment.Take the next step in your career and join Intel's team of innovators dedicated to shaping the future of technology.## Job Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.\\*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.