ATD MIHL Equipment Development Engineer

100 Intel Corporation

Chandler (AZ)

On-site

USD 99,000 - 189,000

Full time

3 days ago
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Benefits offered by this job

Competitive pay
Stock bonuses
Health and retirement benefits
Vacation and parental leave

Job summary

Intel Corporation's Packaging Module Development team is seeking a Packaging Module Development Engineer to advance assembly and packaging technologies. You will develop and optimize processes and equipment to support next-generation packaging solutions, enhancing manufacturing efficiency, product reliability, and quality across Intel's diverse product portfolio.

The role involves applying DOE and SPC, designing equipment to test packaging under thermal and mechanical stress, and ensuring

Qualifications

  • Bachelor’s or higher in a STEM field with several years of experience in packaging/mechanical design.
  • Experience implementing SPC and DOE principles in manufacturing environments.
  • Proficiency with SolidWorks and AutoCAD for mechanical design.

Responsibilities

  • Develop and optimize assembly processes and equipment for quality, cost, yield, and manufacturability.
  • Apply DOE and SPC methods and document findings in technical reports.
  • Design and maintain equipment to evaluate packaging under simulated field conditions.
  • Ensure manufacturability of layouts in package design and oversee workflows.
  • Define material specs and collaborate with supplier quality and procurement.
  • Lead problem-solving and drive continuous improvement in processes.

Skills

SPC
DOE
SolidWorks
AutoCAD
Geometric Dimensioning and Tolerancing

Education

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field
Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field
PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field

Tools

SolidWorks
AutoCAD

Job description

Job Details: Job Description: The Role and Impact Join Intel's Packaging Module Development team as a Packaging Module Development Engineer and contribute to advancing innovative assembly and packaging technologies. In this role, you will develop and optimize processes and equipment to support next-generation packaging solutions. Your work will directly enhance manufacturing efficiency, product reliability, and quality, enabling cutting-edge products that shape Intel's leadership in the semiconductor industry. Business Group Intel's Packaging Module Development team focuses on designing and refining assembly and packaging solutions for Intel's diverse product portfolio. Collaborating with cross-functional teams, this group drives innovation in manufacturing processes and delivers high-quality, reliable solutions that support Intel's mission to deliver world-class technologies to global markets.

Key Responsibilities
  • Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
  • Apply principles of Design of Experiments (DOE) and Statistical Process Control (SPC) to refine processes and specifications, documenting findings through technical reports.
  • Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as temperature cycles, humidity, heat, and dynamic forces.
  • Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
  • Define material specifications and collaborate with supplier quality and procurement teams to ensure adherence to quality and performance benchmarks.
  • Innovate new techniques, tools, and quality screens to proactively identify and address packaging reliability challenges.
  • Set reliability benchmarks based on a thorough understanding of failure mechanisms and customer needs.
  • Lead problem-solving initiatives and drive continuous improvement in processes and equipment.
  • Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
  • Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks.
Qualifications
  • Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 3+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 2+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.
  • Experience in the following: Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Mechanical design software, such as SolidWorks or AutoCAD.
  • Mechanical drawings, Geometric Dimensioning, and Tolerancing principles.
Preferred Qualifications
  • Experience in the following: Program management ability to lead technical innovation and manage complex, time-sensitive projects.
  • Semiconductor fabrication processes, packaging technologies, and robotics.
  • Supply chain management in a manufacturing or materials qualification environment.
Job Type

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Work Model for this Role

This role will require an on-site presence.

* Job posting details (such as work model, location or time type) are subject to change.

Additional Information

Intell is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

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