ASIC Packaging Signal/Power Integrity Engineer [Hybrid]

Anysilicon

San Jose, Northern (CA, KY)

Hybrid

USD 120,000 - 190,000

Full time

30 hours ago
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Job summary

Cisco Silicon One is seeking a Signal and Power Integrity Engineer to join their ASIC team in San Jose, CA. This hybrid role involves developing and verifying packaging for high-performance silicon devices used in data networks.

The ideal candidate has a strong background in high-speed signaling, SI/PI simulations, and experience with Cadence Sigrity, Ansys HFSS, and EM flows. Responsibilities include design rules for ultra-high-speed signaling and post-layout extraction.

Qualifications

  • Bachelor's degree in Electrical Engineering with 4+ years of relevant experience, or a Master's degree with 2+ years, or a PhD with no experience, or equivalent work experience.
  • Expertise in high-speed design principles, including Transmission Line Theory and impedance network analysis, particularly for 56G PAM4 SerDes architectures.
  • Experience with pre- and post-layout SI/PI simulations using Cadence Sigrity and Ansys HFSS.
  • Experience conducting layout reviews and physical design validation using Cadence APD and Ansys EM flows.
  • Working knowledge of SPICE for circuit-level analysis.

Responsibilities

  • Develop, document, and implement design rules for ultra-high-speed signaling to meet power, performance, and area goals.
  • Analyze substrate SI and PI, collaborating with the layout team to optimize solutions across interposer, substrate, and PCB.
  • Design and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting.
  • Collaborate with system partners, vendors, and design leads to resolve complex technical issues and achieve combined power and signal integrity.

Skills

High-speed design
56G PAM4 SerDes
SI/PI simulations
Cadence Sigrity
Ansys HFSS
Cadence APD
Ansys EM flows
SPICE analysis
HBM SI
Die-to-die interfaces
Vector Network Analysis
IBIS basics

Education

Bachelor's degree in Electrical Engineering
Master's degree
PhD with no experience

Tools

Cadence Sigrity
Ansys HFSS
Cadence APD
Ansys EM flows

Job description

ASIC Packaging Signal/Power Integrity Engineer [Hybrid]

Cisco Silicon One is seeking a Signal and Power Integrity Engineer to join their specialized ASIC team in San Jose, CA. This role involves developing and verifying ASIC packaging for high-performance silicon devices that drive complex networks. The ideal candidate will have a strong background in signal and power integrity, high-speed design principles, and experience with industry-standard EDA tools.

Responsibilities:

  • Develop, document, and implement design rules for ultra-high-speed signaling to meet power, performance, and area goals.
  • Analyze substrate signal integrity (SI) and power integrity (PI), collaborating with the layout team to optimize solutions across interposer, substrate, and PCB.
  • Design and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting.
  • Collaborate with system partners, vendors, and design leads to resolve complex technical issues and achieve combined power and signal integrity.

Qualifications:

  • Bachelor's degree in Electrical Engineering with 4+ years of relevant experience, or a Master's degree with 2+ years, or a PhD with no experience, or equivalent work experience.
  • Expertise in high-speed design principles, including Transmission Line Theory and impedance network analysis, particularly for 56G PAM4 SerDes architectures.
  • Experience with pre- and post-layout SI/PI simulations using tools like Cadence Sigrity and Ansys HFSS.
  • Experience conducting layout reviews and physical design validation using Cadence APD and Ansys EM flows.
  • Working knowledge of SPICE for circuit-level analysis.

Skills:

  • Strong communication skills to articulate technical concepts to diverse audiences.
  • Experience with high-bandwidth memory (HBM) and high-speed memory interface SI.
  • Familiarity with die-to-die interfaces and advanced packaging techniques.
  • Knowledge of Vector Network Analysis and basic IBIS.
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