ASIC Engineer

Actalent; Fort Collins (CO); On-site; USD 140,000 - 240,000; Full time

Benefits offered by this job

Discretionary annual bonus

Annual equity grants/awards

Medical, dental and vision plans

401(k) with company match

ESPP

Job summary

Actalent in Fort Collins, CO seeks an IC Package Design Manager to lead a team of engineers in designing complex flip-chip‑BGA packages for AI, networking, HPC, and 5G base stations. You will develop high‑performance package designs featuring SerDes, RF/Microwave, HBM and DDR5, and collaborate with a global R&D team.

You will support and develop the engineering team, contribute to technical methodologies, and manage projects, working onsite five days a week in Fort Collins.

Qualifications

• 12+ years of flip-chip‑BGA package design experience.
• Minimum 3 years in a management role.
• Knowledge of package-level signal and power integrity.
• Self-management and organizational skills.
• Technical understanding of the package-design lifecycle (e.g., .mcm, drawings).

Responsibilities

• Lead and manage a team of engineers (6–10) with potential growth.
• Design complex flip-chip‑BGA packages for ASICs with high-speed SerDes.
• Support global R&D in developing high-performance package designs.
• Contribute to technical methodologies and project management.
• Manage team and customer activities to keep projects on track.
• Create and track project plans for 20+ concurrent designs.

Skills

12+ years flip-chip-BGA design

3+ years management

signal integrity

power integrity

self-management

project management

team leadership

communication with customers

Education

Bachelor's or Master's in Electrical Engineering

Tools

Layout

SI/PI extractions

Simulations

Automation code development

Mechanical modeling

Thermal modeling

PCB layout

Job description

Job Description

We are seeking an IC Package Design Manager to lead a team of engineers in designing complex flip-chip-BGA packages for industry-leading ASICs. These ASICs are vital for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. As part of a global R&D team, you will develop high-performance package designs featuring high-speed SerDes, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more. Your role involves supporting and developing the engineering team, contributing to technical methodologies, and managing projects.

Job Title: ASIC Engineer

Job Description

We are seeking an IC Package Design Manager to lead a team of engineers in designing complex flip-chip-BGA packages for industry-leading ASICs. These ASICs are vital for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. As part of a global R&D team, you will develop high-performance package designs featuring high-speed SerDes, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more. Your role involves supporting and developing the engineering team, contributing to technical methodologies, and managing projects.

Responsibilities

• Lead and manage a team of 6-10 engineers, with potential for team growth.
• Design complex flip-chip-BGA packages for ASICs with high-speed SerDes and high-power delivery needs.
• Support the worldwide R&D team in developing high-performance package designs.
• Contribute to the development of technical methodologies and project management.
• Manage team and customer activities to ensure projects stay on track.
• Create and track project plans for over 20 concurrent designs, managing scope, schedules, and resources.
• Communicate plans, status updates, next steps, and risks effectively.
• Steer package technology and design rules with input from team members.
• Collaborate with customers, vendors, and cross-functional teams.

Essential Skills

• 12+ years of experience in flip-chip-BGA package design, including high-speed SerDes.
• Minimum of 3 years in a management role.
• Bachelor's or Master's degree in Electrical Engineering or a similar field.
• Knowledge of package-level signal and power integrity.
• Self-management and organizational skills.
• Technical understanding of the package-design lifecycle, including .mcm, package spreadsheets, and drawings.

Additional Skills & Qualifications

• Experience with layout, SI/PI extractions, and simulations.
• Automation code development skills.
• Mechanical and thermal modeling expertise.
• Proficiency in project management.
• Ability to understand skill sets and traits of team members to maximize productivity and retention.
• Experience with new business quotes, power integrity, and PCB layout.

Work Environment

This role requires working onsite five days a week, split between San Jose and Fort Collins locations. The work environment supports collaboration with a worldwide team across multiple time zones, requiring co-design with internal team members and external designers.

Job Type & Location

This is a Permanent position based out of Fort Collins, CO.

Pay And Benefits

The pay range for this position is $140000.00 - $240000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Workplace Type

This is a fully onsite position in Fort Collins,CO.

Application Deadline

This position is anticipated to close on Sep 4, 2026.

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing® winner for both client and talent service.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email [e-mail] for other accommodation options.

San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.

Massachusetts Lie Detector: It is unlawful in Massachusetts to require or administer a lie detector test as a condition of employment or continued employment. An employer who violates this law shall be subject to criminal penalties and civil liability.

Use of Artificial Intelligence (AI): We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.