Sr. IC Package Design Engineer (Silicon Engineering)

United States Digital Space LLC; Austin (CA); On-site; USD 165,000 - 260,000; Full time

Benefits offered by this job

Stock options

Medical, dental, vision coverage

401(k) plan

Paid vacation

Holidays and sick leave

Job summary

United States Digital Space LLC in Austin, Texas is seeking a Sr. IC Package Design Engineer (Silicon Engineering) to lead packaging for in-house ASICs and RFICs for digital beam formers and modems.

You will own package selection, layout, verification, and tapeout, collaborating with cross-functional teams across the company. The role requires 5+ years in IC package design, hands-on experience with SI/PI, RF, and substrate design for high-speed die; familiarity with Cadence APD+/SIPor similar

Qualifications

• Bachelor's degree in electrical/ computer engineering or physics.
• 5+ years of experience with IC package design.
• Experience with Co-packaged Optics (CPO) is a plus.
• Strong SI/PI and RF/substrate design fundamentals.

Responsibilities

• Own and drive advanced package selection and BGA configuration.
• Manage package/SIP layout, verification and tapeout.
• Coordinate with cross-functional groups on packaging feasibility and design.
• Optimize silicon floor plan, bump and package pinout.
• Simulate and optimize signal/power integrity and RF performance.

Skills

IC package design

Signal integrity

Power integrity

RF package design

EM simulation

SI/PI analysis

Education

Bachelor's degree in electrical engineering, computer engineering, or physics

Tools

Cadence APD+/SIPor

SIWave

HFSS

ADS

Job description

the company was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today the company is actively developing the technologies to make this possible, with the ultimate goal ofenabling human life on Mars.

SR. IC PACKAGE DESIGN ENGINEER (SILICON ENGINEERING)

At the company we’re leveraging our experience in building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation and is providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We’ve only begun to scratch the surface of Starlink’s potential global impact and are looking for best-in-class engineers to help maximize Starlink’s utility for communities and businesses around the globe.

We are seeking a motivated, proactive, and intellectually curious engineer who will work alongside world-class cross-disciplinary teams (systems, firmware, architecture, design, validation, product engineering, ASIC implementation). In this role, you will be developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures around the globe. These chips are enabling connectivity in places it has previously not been available, affordable or reliable. As an IC Package Design Engineer, you will be an integral part of the IC design team and lead packaging for custom in-house ASICs and RFICs for digital beam formers and modems.

RESPONSIBILITIES:

• Own and drive advanced package selection, new product BGA configuration and package structure
• Responsible for package/SIP layout, optimization, design verification and tapeout
• Interface and coordinate with cross-functional groups throughout the company on new product package selection, feasibility analysis and design
• Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
• Simulate and optimize signal/power integrity and RF performance of the package design
• Drive methodology, innovations, and productivity improvements in package design

BASIC QUALIFICATIONS:

• Bachelor's degree in electrical engineering, computer engineering, or physics
• 5+ years of experience with IC package design

PREFERRED SKILLS AND EXPERIENCE:

• Experience with Co-packaged Optics (CPO)
• Thorough understanding of signal and power integrity fundamentals
• Substrate design experience for RF, digital, high-speed and mixed signal die
• Experience with Cadence APD+/SIPor similardesign tools
• Experience in package design electrical review, SI/PI analysis
• Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
• Experience in package design for manufacturing reviews
• Familiar with BGA package substrate technologies
• Strong problem solving skills with strong engineering fundamentals

ADDITIONAL REQUIREMENTS:

• Ability to work extended hours or weekends as needed to meet mission critical deadlines

COMPENSATION & BENEFITS:

Pay range:RF Engineer/Senior: $165,000.00 - $260,000.00/per year

Your actual level and base salary will be determined on a case-by-case basis and may vary based on the following considerations: job-related knowledge and skills, education, and experience.

Base salary is just one part of your total rewards package at the company. You may also be eligible for long-term incentives, in the form of company stock, stock options, or long-term cash awards, as well as potential discretionary bonuses and the ability to purchase additional stock at a discount through an Employee Stock Purchase Plan. You will also receive access to comprehensive medical, vision, and dental coverage, access to a 401(k) retirement plan, short & long-term disability insurance, life insurance, paid parental leave, and various other discounts and perks. You may also accrue 3 weeks of paid vacation & will be eligible for 10 or more paid holidays per year. Exempt employees are eligible for 5 days of sick leave per year.

ITAR REQUIREMENTS:

• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

the company is an Equal Opportunity Employer; employment with the company is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of the company’s Affi