Senior Process Engineer

Actalent; Carlsbad (CA); On-site; USD 150,000 - 195,000; Full time

Benefits offered by this job

Relocation assistance

Stock options

401(k) plan

Company-paid healthcare

Job summary

Actalent is seeking a Senior Process Engineer to lead the development, optimization, and scaling of advanced manufacturing and packaging processes for optoelectronic products in Carlsbad, CA. You will own process development for flip chip assembly and thermo-compression bonding, with 2.5D/3D packaging initiatives and transition to high-volume production.

You will guide DOE studies, Yield analysis, and reliability tasks while collaborating with cross-functional teams and suppliers. Expect <20% travel to Asia and domestic sites as needed.

Qualifications

• 5+ years of process engineering experience within semiconductor, photonics, optoelectronics, or advanced manufacturing environments.
• Hands-on experience with die-level flip chip packaging beyond SMT/PCB assembly.
• Experience with Die-to-Wafer or Wafer-Level Packaging processes.
• Thermo-Compression Bonding (TCB) setup, optimization, and troubleshooting.
• Proven ability to bring manufacturing processes to production scale.
• DOE, FMEA, yield analysis, and SPC methodologies.
• Experience with JMP, Minitab for data analysis and optimization.
• Knowledge of packaging reliability principles and failure analysis.

Responsibilities

• Develop, refine, and optimize manufacturing processes for optoelectronic and silicon photonics products.
• Design and implement advanced packaging, focusing on flip chip and TCB.
• Support 2.5D/3D packaging architectures for next-gen products.
• Plan experiments and DOE studies to improve yield and quality.
• Monitor yield, process health, and failure trends for improvements.
• Perform root-cause analysis and resolve manufacturing issues.
• Create SOWs and project plans for development initiatives.
• Collaborate with suppliers, OSATs, and contract manufacturers.
• Scale processes from development to high-volume production.
• Contribute to pilot line buildout and advanced packaging capabilities.
• Apply statistical methods to yield analysis and SPC.
• Provide technical leadership in advanced packaging.

Skills

Flip chip packaging

Thermo-Compression Bonding

DOE / Design of Experiments

FMEA

Statistical process control

JMP / Minitab

Packaging reliability

Cross-functional collaboration

Travel readiness

Education

Bachelor's degree in Engineering

Tools

JMP

Minitab

Job description

Job Description

Senior Process Engineer role focuses on developing, optimizing, and scaling advanced manufacturing and packaging processes for optoelectronic and silicon photonics products. You will lead process development for flip chip assembly and thermo-compression bonding, support 2.5D and 3D packaging architectures, and play a key role in transitioning processes from development to high-volume production. This is a high-visibility position with significant ownership and impact in a rapidly growing, well-funded startup operating in a state-of-the-art cleanroom and pilot manufacturing environment.

Job Title

Senior Process Engineer

Responsibilities

• Develop, refine, and optimize manufacturing processes used in the assembly of optoelectronic and silicon photonics products.
• Design and implement advanced packaging processes, with a primary focus on flip chip assembly and thermo-compression bonding (TCB).
• Support the development and implementation of 2.5D and 3D packaging architectures for next-generation products.
• Work cross-functionally with optics, electronics, and process engineering teams to define experiments and execute DOE (Design of Experiments) studies aimed at improving yield, quality, and performance.
• Monitor process health, yield metrics, and failure trends to identify areas for improvement and risk mitigation.
• Perform detailed root cause analysis and process troubleshooting to resolve manufacturing issues and improve reliability.
• Create statements of work (SOWs) and project plans for new process development initiatives and continuous improvement projects.
• Collaborate closely with suppliers, subcontractors, OSATs, and contract manufacturers to align process requirements and ensure robust execution.
• Help scale manufacturing processes from development and pilot line stages into volume production, ensuring manufacturability and repeatability.
• Contribute to the buildout of pilot manufacturing lines and the implementation of advanced packaging capabilities.
• Apply statistical methods and tools to conduct yield analysis, FMEA, and statistical process control to maintain and improve process performance.
• Provide technical leadership and act as a key subject matter expert on advanced packaging within the organization.
• Support domestic and international travel, including visits to Asia, to engage with OSAT and manufacturing partners as needed (less than 20% travel).

Essential Skills

• 5+ years of process engineering experience within semiconductor, photonics, optoelectronics, or advanced manufacturing environments.
• Strong, hands-on experience with die-level flip chip packaging, specifically beyond SMT or PCB assembly.
• Proven experience with Die-to-Wafer or Wafer-Level Packaging processes.
• Thermo-Compression Bonding (TCB) experience required, including process setup, optimization, and troubleshooting.
• Demonstrated experience developing manufacturing processes and successfully bringing them to production scale.
• Working knowledge of DOE (Design of Experiments), FMEA, yield analysis, and statistical process control methodologies.
• Experience using JMP, Minitab, or similar statistical software for data analysis and process optimization.
• Understanding of packaging reliability principles and failure analysis techniques in semiconductor or photonics manufacturing.
• Ability to work effectively in a fast-paced, highly collaborative startup environment.
• Willingness to travel domestically and internationally, including occasional travel to Asia, with less than 20% total travel.

Additional Skills & Qualifications

• Background in semiconductor, optoelectronics, photonics, or advanced packaging manufacturing.
• Experience in process development and optimization for flip chip, wafer fab, and wafer-level packaging.
• Familiarity with reliability testing and qualification processes for advanced packaging technologies.
• Bachelor's degree in Engineering, Physics, Materials Science, or a related field preferred.
• Equivalent industry experience may be considered in lieu of a formal degree.
• Comfort working with cross-functional engineering teams and external manufacturing partners.
• Interest in contributing to the buildout of pilot lines and scaling advanced packaging initiatives in a startup setting.

Work Environment

This role is 100% onsite in Carlsbad, CA, within a startup environment of approximately 30 employees globally and about 12 employees onsite. You will work in a state-of-the-art cleanroom and pilot manufacturing environment alongside a collaborative engineering culture that values direct impact and ownership. The typical schedule runs from 8:00 AM to 5:00/5:30 PM, with less than 20% travel required, including occasional trips to Asia to support OSAT and manufacturing partners. The organization offers excellent benefits, including comprehensive healthcare options with high employer contribution, HSA support, 401(k), stock options, and relocation assistance for exceptional candidates. The environment emphasizes advanced silicon photonics technology, strong funding, and high customer demand, providing a unique opportunity to be the first Senior Process Engineer focused on advanced packaging initiatives and to shape process development and manufacturing scale-up efforts.

Job Type & Location

This is a Permanent position based out of Carlsbad, CA.

Pay And Benefits

The pay range for this position is $150000.00 - $195000.00/yr.
Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

• The organization offers excellent benefits, including comprehensive healthcare options with high employer contribution, HSA support, 401(k), stock options, and relocation assistance for exceptional candidates.
• Excellent benefits including 100% company-paid healthcare options, HSA contributions, 401(k), and stock options.

Workplace Type

This is a fully onsite position in Carlsbad,CA.

Application Deadline

This position is anticipated to close on Aug 31, 2026.

About Actalent

Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 20,000 consultants and 5,000 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500. We are proud to be an Engineering News-Record (ENR) Top 500 Design Firm for our engineering design services and a ClearlyRated Best of Staffing® winner for both client and talent service.

The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.

If you would like to request a reasonable accommodation, such as the modification or adjustment of the job application process or interviewing process due to a disability, please email [e-mail] for other accommodation options.

San Francisco Fair Chance Ordinance: Pursuant to the San Francisco Fair Chance Ordinance, for all positions located in the city and county of San Francisco, we will consider for employment qualified applicants with arrest and conviction records.

Massachusetts Lie Detector: It is unlawful in Massachusetts to require or administer a lie detector test as a condition of employment or continued employment. An employer who violates this law shall be subject to criminal penalties and civil liability.

Use of Artificial Intelligence (AI): We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.