ASIC Design - Floorplan Engineer

8213 Avago Technologies U.S. Inc.; Fort Collins (CO); On-site; USD 150,000 - 230,000; Full time

Benefits offered by this job

Medical Insurance

Dental & Vision

401(k) matching

ESPP

Employee Assistance Program

Paid holidays

Paid sick leave

Vacation time

Job summary

Broadcom, Inc. in Fort Collins, Colorado, is seeking a Floorplan Engineer to drive chip-level physical architecture for advanced ASICs beyond 1 GHz. You will shape top-level floorplan, partitioning, and hierarchy across AI, networking, and computing SoCs from concept to production.

Join a world-class design team using 3 nm and smaller nodes, collaborating with RTL, timing, and packaging to optimize PPA and ensure tapeout readiness. Strong TCL scripting, Linux, and Cadence tooling are required.

Qualifications

• BS with 12+ years or MS with 10+ years of relevant ECE experience.
• Strong floorplanning and die partitioning skills.
• Proficiency with TCL scripting and Linux.

Responsibilities

• Define and optimize top-level floorplan architecture, including die size estimation and partitioning.
• Drive macro placement, power grid design, clock distribution planning, pin placement, and feedthrough optimization.
• Collaborate with RTL, timing, and packaging teams to balance performance, power, and area (PPA).
• Lead top-level timing closure, congestion analysis, and ECO implementation to ensure clean tapeout readiness.
• Coordinate with block owners and integration teams for smooth block-level to top-level convergence.
• Support cross-functional design integration and provide guidance to partners.
• Apply deep understanding of PnR, timing closure, physical verification, and IR/EM analysis to achieve signoff-quality results.
• Contribute to design flow automation and methodology development for advanced process technologies.

Skills

VLSI design

Floorplanning

Die partitioning

Clock networks

PPA optimization

TCL scripting

Linux

Cadence

Education

BS in Electrical or Computer Engineering

MS in Electrical or Computer Engineering

Tools

Cadence tools

EDA software

Job description

Job Description

Be part of the Custom Silicon Design Team within Broadcom's ASIC Products Division in beautiful Fort Collins, Colorado. Join a world-class engineering group developing custom CMOS ASICs for cutting-edge AI, Cellular, Networking, Computing, and Storage products. This Floorplan Engineer role focuses on chip-level physical architecture and integration for advanced ASICs operating at speeds exceeding 1 GHz, from concept through production. The position provides hands-on experience with the latest 3 nm and smaller process nodes, defining and optimizing the overall die layout, including partitioning, hierarchy, and placement of major functional blocks, memories, and I/O structures for AI, computing, and networking SoCs.

Key Responsibilities

• Define and optimize top-level floorplan architecture, including die size estimation, hierarchy definition, and partitioning.
• Drive macro placement, power grid design, clock distribution planning, pin placement, and feedthrough optimization.
• Collaborate closely with RTL, timing, and packaging teams to balance performance, power, and area (PPA) targets.
• Lead top-level timing closure, congestion analysis, and ECO implementation to ensure clean tapeout readiness.
• Coordinate with block owners and integration teams for smooth block-level to top-level convergence.
• Support cross-functional design integration, providing guidance and technical support to internal and external partners.
• Apply a deep understanding of block PnR, timing closure, physical verification, and IR/EM analysis to achieve signoff-quality results.
• Contribute to design flow automation and methodology development for advanced process technologies.

Technical Skills / Background

• Strong foundation in VLSI design principles and ASIC physical design fundamentals.
• In-depth experience with floorplanning, die partitioning, and hierarchical design.
• Working knowledge of PLLs, clock networks, power delivery, and timing-critical structures.
• Proven ability to drive PPA optimization through innovative layout and planning strategies.

Coding & Tool Proficiency

• Strong experience with TCL scripting and Linux environments is required.
• Proficiency in Python, Perl, or Ruby is preferred.
• Experience with Cadence or equivalent physical design tools is highly desirable.

Collaboration and Leadership

• Excellent communication, organizational, and problem-solving skills.
• Ability to work effectively with customers and cross-functional teams across global sites and time zones.
• Skilled at organizing and presenting large data sets, managing multiple priorities efficiently.
• Exercises independent judgment and strong engineering insight in defining methods, techniques, and evaluation criteria.
• Provides technical leadership, mentors others, and leads execution of new initiatives.

Education and Experience

BS in Electrical or Computer Engineering with 12+ years of relevant experience, or MS in Electrical or Computer Engineering with 10+ years of relevant experience.

Compensation and Benefits

The annual base salary range for this position is USD To USD

All subject to relevant plan documents and award agreements.

• Medical
• dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidayspaid sick leave
• vacation time

The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Equal Opportunity

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

Company

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.