AI & HPC Hardware Architect — Lead System Design

Molex; Fremont (CA); On-site; USD 140,000 - 225,000; Full time

Job summary

Molex is seeking a Senior Hardware Architect to shape next-generation HPC/AI hardware systems. Lead system-level design across electrical, thermal, and mechanical domains, collaborating with electrical, thermal, and mechanical teams to deliver scalable, high-performance reference designs.

You will drive SerDes performance, retimer technology, and advanced packaging, benchmarking against industry standards while ensuring robust power delivery and thermal solutions for demanding AI/ML workloads.

Qualifications

• Experience in hardware design and architecture for high-performance systems.
• Strong knowledge of power delivery, signal integrity, and thermal management.
• Experience with AI accelerators (GPU/TPU/IPU) is a plus.

Responsibilities

• Own and drive hardware architecture and system-level design across electrical, thermal, and mechanical domains.
• Define scalable, reliable reference designs and collaborate with cross-functional teams.
• Lead SerDes, retimers, and advanced packaging discussions and design reviews.
• Identify bottlenecks and optimize performance for AI/HPC workloads.

Skills

Hardware architecture

System-level design

Power delivery

Thermal management

Education

Bachelor's degree in Electrical Engineering

Master's degree preferred

Tools

HFSS

PCB CAD

Job description

Molex is seeking a Senior Hardware Architect to shape next-generation HPC/AI hardware systems. Lead system-level design across electrical, thermal, and mechanical domains, collaborating with electrical, thermal, and mechanical teams to deliver scalable, high-performance reference designs.

You will drive SerDes performance, retimer technology, and advanced packaging, benchmarking against industry standards while ensuring robust power delivery and thermal solutions for demanding AI/ML workloads.