AI-First Hardware TPM: Silicon Photonics Tapeout Lead

Neurophos; Austin (TX); On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

Health plan premium coverage

Unlimited PTO

401(k) matching & stock options

Voluntary benefits

Job summary

Neurophos is seeking an experienced hardware TPM to lead the EIC program end‑to‑end in Austin, TX. You will coordinate architecture, RTL, DV, analog/mixed‑signal, and packaging activities with internal teams and external vendors to deliver tapeout and post‑silicon readiness.

The role emphasizes AI‑augmented project management, risk control, and a hands‑on approach to establish processes in a fast‑moving startup. You will report to the Director of Technical Program Management.

Qualifications

• BS in Electrical/Computer Engineering or equivalent; MS preferred.
• 10+ years in ASIC/SoC development and TPM leadership on complex silicon programs.
• Experience taking multiple silicon programs from architecture to tapeout and post-silicon bring-up.

Responsibilities

• Drive end-to-end EIC program: schedule, milestones, risk register, staffing, and tapeout readiness.
• Champion AI-first development flow across spec, schedule tracking, and documentation.
• Converge EIC spec with architecture; drive reviews, change control, and baseline stability.
• Coordinate RTL, DV, analog/mixed-signal, DFT, and physical design teams; manage external partners.
• Adopt AI-assisted design, verification, and debug-triage flows to protect schedules and quality.
• Run tapeout readiness and post-tapeout bring-up; plan lab readiness and OSAT coordination.

Skills

Cross-functional leadership

Program management

Communication with engineers

AI tooling awareness

Risk management

Education

BS in Electrical/Computer Engineering

MS preferred

Tools

Jira

AI tooling ecosystem

Job description

Neurophos is seeking an experienced hardware TPM to lead the EIC program end‑to‑end in Austin, TX. You will coordinate architecture, RTL, DV, analog/mixed‑signal, and packaging activities with internal teams and external vendors to deliver tapeout and post‑silicon readiness.

The role emphasizes AI‑augmented project management, risk control, and a hands‑on approach to establish processes in a fast‑moving startup. You will report to the Director of Technical Program Management.