AI-Enabled DRAM Pathfinding & Process Integration Lead

Micron Technology, Inc.; City of Albany (NY); On-site; USD 159,000 - 271,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Job summary

Micron Technology, Inc. is seeking a DRAM Pathfinding & Process Integration Engineer to lead early-phase technology investigations and process integration for next-generation DRAM architectures.

You will define requirements and translate them into coordinated process solutions, collaborating with device engineering, lithography, etch, thin films, CMP, metrology, modeling, and manufacturing teams. You will build partnerships with NY CREATES and research collaborators to assess new technologies,

Qualifications

• Master's degree or equivalent in a technical field with 5+ years semiconductor experience.
• Strong knowledge of memory technologies including DRAM/NAND/SRAM.
• Experience with DOE methodologies, statistical analysis, and technical problem-solving.
• Proven ability to influence and collaborate across multidisciplinary teams.

Responsibilities

• Lead technology pathfinding for upcoming DRAM concepts, materials, and process architectures.
• Assess scaling approaches supported by High-NA EUV and advanced patterning.
• Develop learning plans and evaluation approaches to speed decisions.
• Coordinate with lithography, etch, films, CMP, metrology, modeling, and device engineering teams.
• Establish criteria for structure, electrical performance, reliability, and design rules.

Skills

DOE methodologies

Statistical analysis

AI/ML proficiency

Cross-functional collaboration

Education

Master's degree in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or related field

PhD preferred

Tools

Python

JMP

SQL

Machine learning

Job description

Micron Technology, Inc. is seeking a DRAM Pathfinding & Process Integration Engineer to lead early-phase technology investigations and process integration for next-generation DRAM architectures.

You will define requirements and translate them into coordinated process solutions, collaborating with device engineering, lithography, etch, thin films, CMP, metrology, modeling, and manufacturing teams. You will build partnerships with NY CREATES and research collaborators to assess new technologies,