Advanced Packaging Process Technician — Drive Innovation

Micron Technology, Inc

Boise (ID)

On-site

USD 52,000 - 78,000

Full time

14 days+

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Benefits offered by this job

Medical, dental and vision plans
Paid time off
Paid holidays

Job summary

Micron Technology, Inc in Boise, Idaho is seeking a Manufacturing Process Technician within the Advanced Packaging Technology Development (APTD) group to help advance memory and storage interconnects and packaging solutions.

You will monitor and improve equipment, perform preventative maintenance, troubleshoot, support cycle time reductions, and analyze workstation performance to drive continuous improvement.

Qualifications

  • AS/AS degree or STEM-related degree required.
  • 1+ year experience using SPC software (e.g., Minitab, JMP).
  • 2+ years industry experience or equivalent military training and experience.
  • 2+ years experience identifying performance gaps and implementing strategic improvements.

Responsibilities

  • Complete required safety training and consistently follow safety protocols during all work activities.
  • Identify and resolve chronic inefficiencies through continuous improvement initiatives, training, or area suggestions.
  • Review and prioritize Prod/Dev hold lots, escalating issues as needed to maintain workflow.
  • Perform technical tests and experiments to support R&D engineering in semiconductor wafer fabrication.
  • Set up and operate semiconductor processing equipment; monitor and guide line operators to ensure quality.
  • Analyze test run data and prepare reports to assist engineering teams in identifying yield issues or validating new products.
  • Communicate effectively in both written and verbal formats, manage time and tasks to meet deadlines independently.

Skills

Performance improvement

Education

AS/AS degree or STEM-related degree

Tools

Minitab
JMP

Job description

Micron Technology, Inc in Boise, Idaho is seeking a Manufacturing Process Technician within the Advanced Packaging Technology Development (APTD) group to help advance memory and storage interconnects and packaging solutions.

You will monitor and improve equipment, perform preventative maintenance, troubleshoot, support cycle time reductions, and analyze workstation performance to drive continuous improvement.

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