WATD Module Development Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 156,000 - 298,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Vacation

Job summary

Intel Corporation in Oregon seeks a talented Module Development Engineer in the Wafer Assembly Technology Development group to advance semiconductor manufacturing, design and optimize processes and equipment, impacting device performance.

This on-site role requires deep experience in process development and collaboration with suppliers, with opportunities to influence technology roadmaps and manufacturing efficiency at a global leader.

Qualifications

• Bachelor’s degree with 9+ years of relevant experience or advanced degrees with required years.
• Experience in semiconductor processing, wafer-level assembly or cleanroom environments.
• Hands-on module engineering, equipment troubleshooting, and preventive maintenance.

Responsibilities

• Lead design and development of manufacturing processes and equipment for next-generation semiconductor products.
• Conduct feasibility studies using simulations and engineering methods to meet device specs.
• Optimize process integration through material selection, metrology, and parameter settings.
• Develop technology roadmaps and collaborate with suppliers to enable advanced manufacturing.

Skills

Semiconductor process

Module engineering

Statistical methods (DOE SPC)

Problem solving

Education

Bachelor’s degree in mechanical engineering, chemical engineering, materials science, electrical engineering, physics, or related STEM field

Master’s degree in a related STEM field

PhD in a related STEM field

Tools

SECS/GEM data streams

SEMI standards

JMP

Minitab

Python/pandas

Job description

Job Details:

Job Description:

Intel Corporation is one of the world’s leading semiconductor companies, dedicated to designing and manufacturing innovative technology that powers the devices and infrastructure shaping modern life. With a legacy of breakthrough innovation spanning decades, Intel continues to push the boundaries of what’s possible — from advanced chip manufacturing to next-generation packaging technologies. At Intel, we believe in the power of human ingenuity, and we’re committed to creating an inclusive, collaborative environment where the brightest minds come together to change the world.

We are looking for a talented and driven Module Development Engineer to join Intel’s Wafer Assembly Technology Development (WATD) group in Oregon. In this high-impact role, you will be at the forefront of advancing Intel’s semiconductor manufacturing capabilities, driving the design, development, and optimization of complex processes and equipment. Your work will directly influence Intel’s technology roadmap, manufacturing efficiency, and product quality — helping Intel maintain its leadership position in global semiconductor innovation. This is a unique opportunity to work alongside industry experts, collaborate with world-class suppliers, and contribute to technologies that will define the future of computing.

Key Responsibilities:

• Lead the design and development of advanced manufacturing processes and equipment solutions for next-generation semiconductor products
• Conduct feasibility studies using theoretical simulations and practical engineering methods to meet device specifications
• Optimize process integration through material selection, equipment metrology, and parameter settings for new product designs
• Perform pathfinding activities to develop processes and hardware for innovative device architectures
• Develop and implement technology roadmaps that support future manufacturing needs
• Recommend and implement modifications to equipment and manufacturing techniques to improve efficiency, reliability, and output
• Collaborate with equipment suppliers and materials vendors to develop enabling technologies for advanced manufacturing solutions
• Design and execute experiments using statistical methodologies (DOE, SPC) to optimize process windows and control strategies
• Stay current with industry trends, emerging technologies, and process innovations, contributing to Intel’s competitive edge

As a Successful Candidate, You Will Bring:

• Communicates complex technical concepts clearly and confidently to diverse audiences
• Thrives in a collaborative, cross-functional team environment
• Approaches challenges with curiosity, creativity, and a solutions-oriented mindset
• Demonstrates strong attention to detail and a commitment to quality
• Adapts quickly to evolving priorities and ambiguous problem spaces
• Takes ownership of your work and drives initiatives through to completion
• Builds strong relationships with internal teams, vendors, and industry partners
• Leads with integrity, humility, and a passion for continuous learning

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This Position is not eligible for Intel immigration sponsorship.

Minimum Qualifications:

• Bachelor’s degree in mechanical engineering, chemical engineering, materials science, electrical engineering, physics, or a related STEM field with 9+ years of relevant experience; OR Master’s degree in a related STEM field with 6+ years of relevant experience; OR PhD in a related STEM field and 4+ years of relevant experience
• Relevant experience can be any of the following:
  • Semiconductor processing, wafer-level assembly, or cleanroom environments
  • Process development methodologies, statistical process control, and manufacturing process improvement
  • Hands‑on experience with module engineering, equipment troubleshooting, and preventive maintenance procedures

Preferred Qualifications:

• 10+ years of experience in:
  • Leading process development programs from strategy formation to high-volume production
  • Direct experience with semiconductor assembly processes, including pick‑and‑place, die attach, wire bonding, or flip chip
  • Knowledge of SECS/GEM data streams and SEMI standards for equipment performance tracking
  • Experience with first-of-a-kind (FOK) tools for new technology insertion and supplier collaboration

Background in statistical analysis using tools like JMP, Minitab, or Python/pandas

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-298,440.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on‑site presence. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.