Advanced Packaging Lithography Development Manager

Intel Corporation

Hillsboro (OR)

On-site

USD 156,000 - 298,000

Full time

14 days+

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Job summary

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead lithography development for next-generation packaging solutions. The role oversees a team of engineers, defines process roadmaps, and drives yield improvement and defect reduction to support Intel's packaging technologies.

With expertise in lithography, DOE, and vendor relations, the candidate will collaborate across cross-functional teams to enable technology transfer to high-volume manufacturing and

Qualifications

Master or PhD in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
6+ years with a master's degree, 5+ years with a PhD; experience includes scanner/stepper systems and/or track equipment.
Experience in lithography process optimization, yield enhancement, and/or manufacturing readiness.

Responsibilities

Lead and manage a team of engineers with clear goals and coaching to foster a productive environment.
Formulate long-term strategy for lithography process roadmap to maintain leadership in advanced packaging.
Drive technical excellence and innovation within the etch team; support vendor relations and DOE applications.
Develop and execute project schedules; track milestones and ensure cross-functional communication.

Skills

Project management

DOE principles

Team leadership

Communication

Education

Master's degree in Physics/Electrical/Materials/Mechanical

PhD in related field

Tools

Scanner/stepper systems (ASML/Canon/Nikon)

Track equipment

Job description

Job Details: Job Description:

Intel Foundry is seeking an Advanced Packaging Lithography Module Development Manager to lead our lithography development for next-generation packaging solutions. This role will drive the development and implementation of lithography equipment and processes critical to Intel's industry-leading advanced packaging portfolio, focused on Foveros Direct technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in patterning flow definition and process development. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.

Key Responsibilities

Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
Drive lithography module and segment related yield improvement initiatives and defect reduction programs
Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing

The candidate should exhibit the following behavioral traits

Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.

Qualifications

Minimum Qualifications

Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
6+ years of relevant experience with a master's degree, 5+ years or experience with a PhD degree. The experience listed above should include a combination of the following qualifications: Equipment Mastery: Deep expertise with scanner/stepper systems (ASML, Canon, Nikon) and/or track equipment
Process Development: Extensive experience in lithography process optimization, yield enhancement, and/or manufacturing readiness
Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.

Preferred Qualifications

Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
Experience with vendor relations, including material quality assessments and performance management.
Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies

Employment Details

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Business group:

Intel Foundry Overview

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US

$155,520.00-298,440.00 USD

Work Model for this Role

This role will require an on-site presence.

Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website.