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SAIC invites applications for a Mechanical Advanced Packaging Engineer located in Crane, IN. The role focuses on supporting missile system hardware packaging with hybrid work options; candidates must reside within commuting distance of Crane, IN.
You will perform mechanical modeling, simulations (FEA/ANSYS, MATLAB), and lithography-aware packaging analyses while collaborating with cross-functional teams. Interim Secret clearance is required to start, with sponsorship for Secret clearance, and US
SAIC invites applications for a Mechanical Advanced Packaging Engineer located in Crane, IN. The role focuses on supporting missile system hardware packaging with hybrid work options; candidates must reside within commuting distance of Crane, IN.
You will perform mechanical modeling, simulations (FEA/ANSYS, MATLAB), and lithography-aware packaging analyses while collaborating with cross-functional teams. Interim Secret clearance is required to start, with sponsorship for Secret clearance, and US