Mechanical Advanced Packaging Engineer

SAIC; Crane (IN); On-site; USD 110,000 - 140,000; Full time

Benefits offered by this job

Hybrid work schedule

Job summary

SAIC invites applications for a Mechanical Advanced Packaging Engineer located in Crane, IN. The role focuses on supporting missile system hardware packaging with hybrid work options; candidates must reside within commuting distance of Crane, IN.

You will perform mechanical modeling, simulations (FEA/ANSYS, MATLAB), and lithography-aware packaging analyses while collaborating with cross-functional teams. Interim Secret clearance is required to start, with sponsorship for Secret clearance, and US

Qualifications

• Bachelor’s degree in mechanical or aerospace engineering (required).
• 5+ years of experience in mechanical modeling and simulation (FEA/ANSYS, MATLAB).
• Experience with or knowledge of systems engineering principles.
• Interim secret clearance required to start, with ability to obtain Secret clearance. SAIC will sponsor the clearance process.
• US citizenship is required.

Responsibilities

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly.
• Perform mechanical modeling and simulation activities, including FEA, thermal fatigue, shock and vibration analysis, and MATLAB-based modeling.
• Apply systems engineering principles throughout all stages of the product lifecycle—requirements, verification, validation.
• Participate in Systems Engineering Technical Reviews (SRR, PDR, CDR, PRR).
• Collaborate with design teams to document design development activities.
• Support TIMs and cross-functional team discussions.
• Analyze solder interconnect technologies (BGA, CGA, Flip-Chip, J-lead).
• Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations.
• Communicate technical findings and recommendations to diverse audiences.

Skills

FEA/ANSYS

MATLAB

Vibration analysis

Thermal fatigue

Systems engineering

Education

Bachelor's degree in mechanical or aerospace engineering

Tools

ANSYS

Job description

Mechanical Advanced Packaging Engineer

Job ID: 2617660

Location: Crane, IN, United States

Date Posted: Oct 12, 2026

Category: Engineering and Sciences

Subcategory: Mechanical Engr

Schedule: Full-Time

Shift: Day Job

Travel: No

Minimum Clearance Required: Interim Secret

Clearance Level Must Be Able to Obtain: Secret

Potential for Remote Work: Hybrid

Job Description

Description

SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. This position offers a hybrid work schedule; however, candidates must reside within commuting distance of Crane, IN.

JOB RESPONSIBILITIES:

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly
• Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling
• Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation
• Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)
• Collaborate with design teams to facilitate and document design development activities
• Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions
• Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages
• Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations
• Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

Qualifications

REQUIRED EDUCATION AND EXPERIENCE:

• Bachelor’s degree in mechanical or aerospace engineering
• 5+ years’ experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
• Experience with or knowledge of systems engineering principles
• Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process
• Must be a US citizen

PREFERRED EXPERIENCE:

• Experience with missile system hardware design and analysis
• Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Overview

SAIC accepts applications on an ongoing basis and there is no deadline.

SAIC® is a premier mission integrator focused on advancing the power of technology and innovation to serve and protect our world. Our robust portfolio of offerings across the defense, space, intelligence, and civilian markets includes secure high-end solutions in mission IT, enterprise IT, engineering services, and professional services. We integrate emerging technology, rapidly and securely, into mission critical operations that modernize and enable critical national imperatives.

We are approximately 23,000 strong; driven by mission, united by purpose, and inspired by opportunities. SAIC is an Equal Opportunity Employer. Headquartered in Reston, Virginia, SAIC has annual revenues of approximately $7.3 billion. For more information, visit saic.com. For ongoing news, please visit newsroom.