Device Packaging & Test Engineering Lead (Asia)

Lyte; Singapore; On-site; SGD 90,000 - 130,000; Full time

Benefits offered by this job

Competitive salary and equity

Comprehensive medical, dental, and vision coverage

Flexible vacation and time-off policy

Collaborative work environment

Job summary

A technology company based in Singapore is seeking an experienced engineering lead to oversee device packaging and test engineering. The ideal candidate should possess at least 12 years of experience and a bachelor's degree in Electrical Engineering or a related field. Responsibilities include leading an operation team, conducting wafer probe tests, and improving packaging processes. The role offers a competitive salary, equity, and a collaborative work environment focused on cutting-edge technologies.

Qualifications

• 12 years of experience in device packaging and assembly.
• Knowledge of wafer level probe tests and electro-optical devices.
• Experience with IIIV or CMOS wafer level processes.

Responsibilities

• Lead Asia operation team and support NPI and volume production.
• Implement wafer level probe tests and improve device packaging.
• Write technical documentation and manage project decisions.

Skills

Device test knowledge

Fast learner

Good work ethics

Education

Bachelor's degree

Tools

Data analysis tools (e.g., JMP)

Job description

A technology company based in Singapore is seeking an experienced engineering lead to oversee device packaging and test engineering. The ideal candidate should possess at least 12 years of experience and a bachelor's degree in Electrical Engineering or a related field. Responsibilities include leading an operation team, conducting wafer probe tests, and improving packaging processes. The role offers a competitive salary, equity, and a collaborative work environment focused on cutting-edge technologies.